Crater detection method

A detection method and crater technology, which are used in measurement devices, semiconductor/solid-state device testing/measurement, material analysis by optical means, etc., can solve problems such as silicon chip damage, inability to monitor crater formation, and reduced copper ball bonding performance.

Inactive Publication Date: 2018-03-13
江阴苏阳电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, compared with the gold wire bonding technology, the hardness of pure copper after burning the ball is almost twice as high as that of the gold ball, while the hardness of the palladium-coated copper wire is higher, which reduces the bonding performance of the copper ball
To overcome the problems of high hardness and high yield of copper wire, greater ultrasonic power and bonding pressure are required during bonding, so it is easy to cause damage to the silicon chip and form craters, seriously affecting product quality and reliability
Conventional gold wire pull and gold ball thrust detection methods cannot monitor the formation of craters

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] The invention mainly aims at the bonding process in the chip packaging process, and provides a crater detection method, which can detect the product quality of the bonding process in real time and ensure the reliability of the product. Specific steps are as follows:

[0015] Step 1. Use a knife to remove the base island after the copper wire is bonded;

[0016] Step 2. Pour the mixed acid solution into a small beaker. The mass ratio of the solution is pure water: nitric acid: phosphoric acid: acetic acid = 5%: 80%: 5%: 10%, and heat it to 80°C on a hot plate, then Put the base island where the copper wire is bonded;

[0017] Step 3. After waiting for about 10 minutes, wash and dry the base island where the copper wire is bonded, then judge it under a microscope with a magnification of 200 times or more, take a picture, save it, and record it;

[0018] Step 4. If the crater cannot be judged, use 20% NaOH solution to repeat the operation from step 2 to step 3.

[0019] The prefer...

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PUM

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Abstract

The crater detection method of the present invention is used for detecting craters of copper wire products during product variety, packaging model, production equipment replacement and parameter adjustment, and the monitoring frequency is very high. The beneficial effects of the present invention are: ① reproducibility, the use of mixed acid solution can be reused, no need to prepare each time, just replace it once a week; ② simple and convenient, less experimental tools, such as probes or knives, microscopes, beakers , pure water and alcohol are common in the construction process, and the bonding process employees can operate according to the process when necessary.

Description

Technical field [0001] The invention relates to the chip packaging industry, in particular to the introduction of crater detection in the bonding process of copper wire products. Background technique [0002] At present, the application hot spots of the semiconductor industry have expanded from the initial computer and communications to consumer electronics, new energy, automotive electronics and other fields. Low cost has always been the core driving factor of the packaging and testing industry downstream of the vertical division of labor. Therefore, in recent years, in addition to technological and product innovations, the semiconductor packaging industry has been constantly looking for technologies with good process performance and low prices to replace gold wires to achieve the purpose of reducing packaging costs and improving reliability. [0003] Because copper wire has good electrical and mechanical properties, it has won the favor of most manufacturers, and began mass prod...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N21/84H01L21/66
CPCG01N21/84G01N2021/8411H01L22/12
Inventor 徐志华葛建秋张彦
Owner 江阴苏阳电子股份有限公司
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