A temperature-pressure composite sensor
A composite sensor, temperature and pressure technology, applied in the direction of instruments, thermometers, scientific instruments, etc., can solve the problems of low measurement accuracy and poor measurement performance, and achieve the effects of temperature drift compensation and improvement of measurement performance
Active Publication Date: 2022-01-11
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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Problems solved by technology
[0003] Existing pressure-temperature composite sensors assemble independent pressure sensors and temperature sensors together to measure temperature and pressure at the same time. This composite sensor separately encapsulates the pressure sensor and temperature sensor and isolates them from the measured medium. Therefore, the measurement accuracy is not high
[0004] Therefore, the existing temperature-pressure composite sensor has the technical problem of poor measurement performance
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[0026] An exemplary embodiment of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown, it is understood that the disclosure can be implemented in various forms without limitation. Instead, these embodiments are provided to be more thoroughly understood to disclose the present disclosure, and can communicate the scope of the scope of the present disclosure to those skilled in the art.
[0027] Embodiments of the present invention provide a thermostatic composite sensor, including pressure sensitive structures and temperature sensitive structures, the pressure sensitive structure and temperature sensitive structure, by connecting, forming the temperature compact composite sensor, which can not only guarantee The test medium and the pressure sensitive structure have a pressure sensitive structure to isolate the complicated external environment, and the tempera...
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Abstract
The present invention relates to the technical field of semiconductor preparation, in particular to a temperature-pressure composite sensor, comprising: a pressure-sensitive structure and a temperature-sensitive structure; the pressure-sensitive structure includes a metal electrode and a first substrate, and the The junction of the metal electrodes is provided with a piezoresistive structure, and a back cavity structure is provided on the back of the first substrate; the temperature sensitive structure includes a second substrate and a metal resistor, and a through hole is provided in the middle of the second substrate, so The metal resistor is arranged around the through hole, the side of the second substrate with the metal resistor is connected to the back of the first substrate, and the temperature sensitive structure and the pressure sensitive structure are stacked and connected, which not only realizes pressure sensitive The isolation of the structure from the complex external environment ensures the contact channel between the measured medium and the sensitive structure, and also realizes the in-situ temperature measurement, which is beneficial to the temperature drift compensation of the pressure sensor and improves the measurement performance.
Description
Technical field [0001] The present invention relates to the field of semiconductor technologies, and in particular, to a thermostatic composite sensor. Background technique [0002] The pressure-temperature composite sensor is used to simultaneously measuring the temperature and pressure of the liquid or gas. [0003] The existing pressure-temperature composite sensor is to assemble the respective independent pressure sensors and temperature sensors to achieve simultaneous temperature and pressure measurements, which are separately encapsulated by pressure sensors and temperature sensors and isolated from the test medium, respectively. Therefore, the measurement accuracy is not high. [0004] Therefore, there is a technical problem with poor measurement performance in the existing temperature composite sensor. Inventive content [0005] In view of the above problems, the present invention is proposed to provide a temperature compact composite sensor overcoming the above problems...
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IPC IPC(8): G01L1/20G01K7/16
CPCG01L1/20G01K7/16
Inventor 解婧李超波林琳何彤郑旭远雁王迪
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI