Temperature and pressure composite sensor

A composite sensor, temperature and pressure technology, used in instruments, thermometers, scientific instruments, etc., can solve the problems of poor measurement performance and low measurement accuracy, and achieve the effect of improving measurement performance

Active Publication Date: 2020-07-10
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Existing pressure-temperature composite sensors assemble independent pressure sensors and temperature sensors together to measure temperature and pressure at the same time. This composite sensor separately encapsulates the pressure sensor and temperature sensor and isolates them from the measured medium. Therefore, the measurement accuracy is not high
[0004] Therefore, the existing temperature-pressure composite sensor has the technical problem of poor measurement performance

Method used

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Embodiment Construction

[0026] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0027] An embodiment of the present invention provides a temperature-pressure composite sensor, which includes a pressure-sensitive structure and a temperature-sensitive structure. The pressure-sensitive structure and the temperature-sensitive structure are connected to form the temperature-pressure composite sensor. The temperature-pressure composite sensor can not only guarantee Good contact between the measured medium and the pre...

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Abstract

The invention relates to the technical field of semiconductor preparation, in particular to a temperature and pressure composite sensor which comprises a pressure sensitive structure and a temperaturesensitive structure. The pressure sensitive structure comprises a metal electrode and a first substrate, a piezoresistive structure is arranged at the joint of the front surface of the first substrate and the metal electrode, and a back cavity structure is formed in the back surface of the first substrate. The temperature sensitive structure comprises a second substrate and a metal resistor, a through hole is formed in the middle of the second substrate, the metal resistor is arranged around the through hole, and the surface, with the metal resistor, of the second substrate is connected withthe back surface of the first substrate. The temperature sensitive structure and the pressure sensitive structure are connected in an up-and-down stacking mode, so that the pressure sensitive structure is isolated from the complex external environment, contact channels between a measured medium and the sensitive structures are guaranteed, meanwhile, temperature in-situ measurement is achieved, temperature drift compensation of a pressure sensor is facilitated, and the measurement performance is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a temperature-pressure composite sensor. Background technique [0002] Pressure-temperature composite sensors are used to measure the temperature and pressure of liquids or gases simultaneously. [0003] Existing pressure-temperature composite sensors assemble independent pressure sensors and temperature sensors together to measure temperature and pressure at the same time. This composite sensor separately encapsulates the pressure sensor and temperature sensor and isolates them from the measured medium. Therefore, the measurement accuracy is not high. [0004] Therefore, the existing temperature-pressure composite sensor has the technical problem of poor measurement performance. Contents of the invention [0005] In view of the above problems, the present invention is proposed to provide a temperature-pressure composite sensor that overcomes the above problems or at l...

Claims

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Application Information

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IPC IPC(8): G01L1/20G01K7/16
CPCG01L1/20G01K7/16
Inventor 解婧李超波林琳何彤郑旭远雁王迪
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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