A kind of manufacturing method of temperature-pressure composite sensor
The technology of a composite sensor and a manufacturing method, which is applied in the field of manufacturing a temperature-pressure composite sensor, can solve problems such as poor process compatibility, low measurement accuracy, and high manufacturing difficulty, so as to improve performance, realize time synchronization, and facilitate temperature drift compensation Effect
Active Publication Date: 2022-01-11
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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Problems solved by technology
[0004] A pressure-temperature composite sensor can assemble independent pressure sensors and temperature sensors together to measure temperature and pressure at the same time. This composite sensor is separately packaged and isolated from the measured medium, so , the measurement accuracy is not high
[0005] Another pressure-temperature composite sensor is to manufacture the pressure sensor and temperature sensor on the same chip, which is difficult to manufacture and has poor process compatibility.
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[0044] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.
[0045] An embodiment of the present invention provides a method for manufacturing a temperature-pressure composite sensor, which includes manufacturing a pressure-sensitive structure and a temperature-sensitive structure. Then, the pressure-sensitive structure and the temperature-sensitive structure are stacked together to realize the isolation of the pressure-sensitive structure from the complex external environment, thereby ensuri...
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Abstract
The present invention relates to the technical field of semiconductor preparation, in particular to a method for manufacturing a temperature-pressure composite sensor, comprising: forming a pressure-sensitive structure, including: forming a piezoresistive structure on the front of a first substrate, and forming a back cavity structure on the back of a second substrate ; forming a metal electrode on the pressure group structure; forming a temperature sensitive structure, specifically including: forming a metal resistance on the second substrate; opening a through hole on the second substrate corresponding to the area surrounded by the metal resistance structure; placing the second substrate The side with the metal resistor is connected to the back of the first substrate to form a temperature-pressure composite sensor. The temperature-sensitive structure and the pressure-sensitive structure are stacked together, which not only realizes the isolation of the pressure-sensitive structure from the complex external environment, but also ensures The contact channel between the measuring medium and the sensitive structure is also realized, and the in-situ temperature measurement is also realized, which is beneficial to the temperature drift compensation of the pressure sensor. By forming a temperature-pressure composite sensitive microstructure, the temperature and pressure information can be picked up in time synchronization and at the same point in space.
Description
technical field [0001] The invention relates to the technical field of semiconductor preparation, in particular to a method for manufacturing a temperature-pressure composite sensor. Background technique [0002] Pressure-temperature composite sensors are used to measure the temperature and pressure of liquids or gases simultaneously. [0003] Existing pressure and temperature composite sensors include the following: [0004] A pressure-temperature composite sensor can assemble independent pressure sensors and temperature sensors together to measure temperature and pressure at the same time. This composite sensor is separately packaged and isolated from the measured medium, so , the measurement accuracy is not high. [0005] Another pressure-temperature composite sensor is to manufacture the pressure sensor and temperature sensor on the same chip, which is difficult to manufacture and has poor process compatibility. [0006] Therefore, how to obtain a temperature-pressure...
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IPC IPC(8): G01L9/06G01L19/00G01K7/18
CPCG01L9/065G01L19/0092G01K7/18
Inventor 解婧李超波林琳范涛王迪远雁刘瑞琪
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI