A method for testing the quality of solder joints
A detection method and solder joint quality technology, applied in the field of solder joint quality detection, can solve problems such as errors in solder joint quality detection results, and achieve accurate and reasonable detection methods
Active Publication Date: 2021-04-13
QUICK INTELLIGENT EQUIP CO LTD
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Problems solved by technology
[0004] The technical problem to be solved by the present invention is: in order to overcome the problem of large errors in the solder joint quality detection results in the prior art, provide a solder joint quality detection method and system
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[0028] The present invention is described in further detail now in conjunction with accompanying drawing. These drawings are all simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, so they only show the configurations related to the present invention.
[0029] Such as figure 1 As shown, a kind of solder joint quality detection method of the present invention comprises the following steps:
[0030] S1. According to the actual welding requirements, set the welding temperature value on the soldering station, and record the corresponding power and temperature when the soldering station reaches the welding temperature value; among them, the soldering station can choose an intelligent lead-free soldering station so that it can automatically record and store the entire Power changes during welding, temperature fluctuations, length of welding time;
[0031] S2. Manual reference welding, as a reference solder joint,...
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The invention relates to a method for detecting the quality of solder joints, comprising the following steps: S1, setting the welding temperature value on the soldering station, and recording the corresponding power and temperature when the soldering station reaches the welding temperature value; S2, referring to the reference solder joint point for welding, record the power, temperature change data and welding time in this welding process; S3, after welding, use the power, temperature change data and welding time data recorded in this welding process as reference values; S4, for Weld the conventional solder joints, record the power and temperature change data and welding time during the welding process; S5, when the power and temperature return to the power and temperature values recorded in step S1, it means that the welding is over and the recording is stopped; S6. Calculating the similarity rate of the reference value of the conventional solder joint; S7. Setting the weight ratio to obtain the qualified rate of the conventional solder joint. The detection result obtained by the above detection method is more accurate and reasonable and scientific.
Description
technical field [0001] The invention relates to the technical field of solder joint detection, in particular to a method for detecting solder joint quality. Background technique [0002] In the process of manufacturing or repairing the PCB board of electronic products, it is necessary to solder the electronic components on the PCB board. The current manual soldering method is still the most commonly used and most common welding method, but due to the artificial and objective factors in the manual soldering process, it is easy to As a result, the welding quality is uneven, and it is difficult to ensure the consistency of the quality of each solder joint in the welding scene with relatively high requirements, resulting in the appearance of defective products. Therefore, it is necessary to remind the quality of the solder joints during the manual welding process, and to evaluate and record the quality of the solder joints after welding. [0003] The traditional detection metho...
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IPC IPC(8): G01N33/207
CPCG01N33/207
Inventor 丁申进乔路
Owner QUICK INTELLIGENT EQUIP CO LTD