The invention discloses a
die bonding device, which comprises a
base station, two slide rail devices are oppositely arranged on the
base station along a second direction, a movable cross beam is slidably arranged between the two slide rail devices, the movable cross beam is arranged in a first direction of the
base station, and the movable cross beam is provided with a
chip mounting head
assembly used for
chip mounting; the feeding module is arranged on the base table and located in the first direction; the
welding table module is arranged at the downstream position of the feeding module, is positioned below the
chip mounting head
assembly, and is used for
processing materials; the discharging module is arranged at the downstream position of the
welding table module, and the discharging module is used for receiving materials from the
welding table module; wherein the base
station is further fixedly provided with an outer cover wrapping the welding
station module,
atmosphere gas can be introduced into the outer cover, and the outer cover is provided with a patch hole and covers a material to be processed to form a closed
processing space. The
nitrogen environment is not mixed with the air environment,
high nitrogen density can be well achieved, and the
nitrogen consumption is relatively less.