10 results about "Solder station" patented technology

The utility model discloses a soldering station module. The soldering station module comprises a soldering station assembly, a first direction driving assembly and a second direction driving assembly which are arranged in an outer cover, wherein the second direction driving assembly is fixedly installed on a base table of the die bonding device, the first direction driving assembly is in transmission fit with the second direction driving assembly, the second direction driving assembly is used for driving the first direction driving assembly to move in the second direction, and the first direction driving assembly is in transmission connection with the welding table assembly. The first direction driving assembly is used for driving the welding table assembly to move in the first direction. Atmosphere gas can be introduced into the outer cover, patch holes are formed in the outer cover, and the outer cover covers a material to be processed to form a closed processing space. According to the utility model, the nitrogen environment is not mixed with the air environment, so that high nitrogen density can be well realized, and the nitrogen consumption is relatively less.

The present invention discloses a parameter management system for a soldering station based on AI, which relates to the field of welding technology. By analyzing in detail the welding temperature state, appearance state, and morphological state of the soldering station, key characteristic parameters of welding quality are extracted, realizing comprehensive monitoring and analysis of the welding process, which helps to track and analyze process problems in the welding process and provides important data basis for subsequent quality control and improvement strategies. By comprehensively analyzing the characteristic parameters, a welding quality index is obtained, and whether the welding parameters need to be adjusted is intelligently judged according to the change trend of the welding quality index, improving the response speed. By comprehensively analyzing the average temperature, average defect, and average shape deviation, the welding speed is obtained, and dynamic adjustment is carried out according to the welding speed to ensure that the welding process is carried out in the optimal state, realizing effective control of welding quality, improving product quality and production efficiency, and reducing the quality risk of welded products.

The invention provides an electric tin sucking mechanism for an ultrasonic device. The electric tin sucking mechanism comprises a suction nozzle mechanism, a pump body, a welding table and a controller. The suction nozzle mechanism comprises a suction nozzle and a solder tip, the pump body is provided with a foot switch and connected with the suction nozzle mechanism, the welding table is connected with the solder tip, and the suction nozzle mechanism, the pump body and the welding table are connected with the controller. The soldering station provides heat for the soldering bit, the soldering bit transmits the heat to the suction nozzle, the heated suction nozzle melts soldering tin, the foot switch is pressed down, the pump body provides vacuum negative pressure for the suction nozzle, and the suction nozzle sucks soldering tin liquid; the pump body is used for sucking tin, the stability of suction force is improved, the pedal switch is used for controlling, the labor-saving effect is achieved, and the working efficiency can be improved.

The utility model provides a circuit board degumming tool and a circuit board degumming system. The circuit board degumming tool comprises a scraper, a soldering bit and a soldering station, wherein the scraper comprises a scraper end head and a connecting end which are connected with each other; the soldering bit is detachably connected with the scraper end head through the connecting end; the welding table is located on the side, away from the scraper, of the soldering bit. According to the embodiment of the invention, by designing the scrapers and the solder tip which are detachably connected, different scrapers can be quickly and conveniently switched according to the connecting mode of the connecting end, different circuit board scenes can be adapted, the efficiency is improved, meanwhile, resources are saved through a ready-made soldering station on an operation site, and in the using process, only the glue fixing position is heated, so that the cost is reduced. And damage to surrounding devices is avoided, and the soldering bit is high in compatibility, high in operability and high in degumming efficiency. The tool is simple in structure and convenient to operate.

The application provides a welding platform and a busbar welding device. The welding platform comprises a base, an electromagnetic heating assembly and a cover plate. The base is provided with a mounting cavity. The electromagnetic heating assembly is arranged in the mounting cavity. The electromagnetic heating assembly comprises a plurality of magnetic cores and a coil wound outside the magnetic cores. The base is further provided with a first gas path. The first gas path is communicated with the mounting cavity through a gas inlet hole. Cooling gas is introduced into the mounting cavity through the first gas path and the gas inlet hole. The cover plate is detachably mounted on the base and covers the top opening of the mounting cavity. The cover plate is used for carrying the busbar to be welded. The base or the cover plate is provided with a gas outlet hole. The mounting cavity is communicated with the outside space through the gas outlet hole. The welding platform of the application is provided with the first gas path in the base. The first gas path can introduce the cooling gas into the mounting cavity. The cooling gas directly cools the magnetic cores when flowing in the mounting cavity, thereby improving the cooling effect of the magnetic cores, ensuring that the heating temperature of the magnetic cores is kept below the Curie temperature, and finally keeping the magnetic flux of the magnetic cores stable.

The present invention discloses an ultra-small relay with a high creepage distance, comprising a base portion and a movable spring-armature combination; the base portion includes a coil, an iron core, a static spring, coil terminals, and a first plastic body that is assembled into a single unit by injection molding. Within the base portion, the static spring injection-molded into the first plastic body comprises only a normally open static spring blade located at the other end of the first plastic body corresponding to the coil axis, and a soldering pad corresponding to a soldering plate structure at least for supporting the movable spring-armature combination at a mid-position along the coil axis, without a normally closed static spring blade. The present invention effectively increases the creepage distance between the coil and the contacts without increasing the size of the relay, thereby meeting the increasingly stringent creepage distance requirements for relay inputs and outputs in new energy, automotive, and other fields.

A wave solder machine performs a wave solder operation on an electronic substrate. The wave solder machine includes a wave solder station having a solder tank with a reservoir of solder, a flow conduit disposed in the reservoir of the solder tank, and a wave solder nozzle assembly coupled to the flow conduit. The nozzle assembly is configured to generate a solder wave. The wave solder machine further includes a conveyor configured to transport the electronic substrate to the wave solder station, at least one first gas diffuser configured to supply a gas to flow over the solder wave on each side of the solder wave and provide a layer of the gas above the solder wave, and at least one second gas diffuser configured to supply a gas under the solder wave on each side of the solder wave and provide a layer of the gas under the solder wave.

A crest soldering machine includes a crest soldering station configured to generate solder waves for performing a crest soldering operation on a printed circuit board. The wave soldering machine further includes a claw conveyor system configured to convey the printed circuit board to the wave soldering station. The claw conveyor system includes at least one chain conveyor including a chain having a plurality of claws configured to support an edge of a printed circuit board. The claw conveyor system further includes a claw detection system having a tension roller assembly configured to engage each claw of the plurality of claws. The tension roller assembly is further configured to move in response to engaging the claw in the inoperative position. The claw conveyor system further includes a sensor configured to detect movement of the tension roller assembly to the inoperative position.

The utility model discloses a printed circuit board (PCB), which relates to the technical field of circuit boards, and is characterized in that the PCB comprises a substrate, one side of the substrate is fixedly connected with a holding plate, a plurality of through grooves are arranged between the substrate and the holding plate, and a heat insulation sleeve is sleeved on the holding plate. According to the utility model, the holding plate and the heat insulation sleeve are arranged, so that in the process of heating by adopting the welding table, only the substrate needs to be placed on the welding table, the holding plate is exposed out of the welding table, after heating is finished, people can take down the substrate from the welding table by holding the holding plate, and the heat insulation sleeve has a heat insulation effect; therefore, less heat on the holding plate is conducted to the heat insulation sleeve, the temperature on the heat insulation sleeve is guaranteed to be low, people can hold the heat insulation sleeve conveniently, the epoxy resin has the advantages of being high in structural strength and long in service life, and the service life and strength of the whole base plate are guaranteed.

This application discloses a relay, including a contact cavity, a stationary contact assembly, a first moving contact, and a first connecting member. The outer surface of the contact cavity is provided with a first soldering station and a second soldering station, which are integrally connected. The stationary contact assembly includes a first stationary contact and a second stationary contact; the first stationary contact is mounted on the first soldering station, and the second stationary contact is mounted in the contact cavity. The first moving contact is movably disposed within the contact cavity, and its two ends are used to contact or separate from the first and second stationary contacts of the stationary contact assembly, respectively. The first connecting member is mounted on the second soldering station.