35 results about "Solder station" patented technology

The invention discloses a seafloor vacuum pipeline traffic system and a pushing type laying method thereof. The system comprises piers built on a seafloor, a pipeline is erected on the piers, the rearend of the pipeline is cooperatively connected with a pushing device and a welding platform, and welded pipelines are pushed to be extended forwards and laid section by section through the pushing device when construction is conducted; the middle of the seafloor vacuum pipeline is provided with a relay pushing station, the pipeline penetrates through the relay pushing station, the relay pushing station is arranged in an artificial island tower, and the front end of the first section pipeline is provided with a positioning guiding diving instrument; the method comprises the steps that a sealing plug is used for sealing a first section pipeline head to be placed into a pushing platform, the pipeline is tightly clamped by a pushing pipe clamp, and another section pipeline is welded to the welding platform; a pushing rod is started, and the pushing pipe clamp and the pipeline enter the sea and are moved forwards constantly until the shore at the other end of the sea is reached. The systemhas the advantages that it is ensured that there exists no bending in the laying process of the pipeline, the system is rapid, efficient and safe, and the engineering cost is low.

A lamp filament lamp base component continuous production apparatus is characterized by comprising a machine frame, a rotating disk arranged on the machine frame and driven by power, clamps arranged at the periphery of the rotating disk and used for clamping the lamp bases, a lamp base molding station, a molybdenum chip bonding station, an upper solder station, a lamp filament soldering station, and a blanking station. The lamp base molding station, the molybdenum chip bonding station, the upper solder station, the lamp filament soldering station, and the blanking station are arranged on the machine frame and arranged from the rotating disk to the periphery sequentially. Compared with prior arts, the lamp filament lamp base continuous production apparatus is advantaged by being high in production efficiency and low in manpower consumption. The lamp filament lamp base continuous production apparatus is also advantaged by being fully automatic.

The invention discloses an accumulator plate pack welding table which comprises a stand, a welding gun rack and an ignition device, wherein both the welding gun rack and the ignition device are arranged on the stand; and the stand is also provided with a rolling way for conveying an accumulator plate pack. By adopting the welding table, a mechanical clamping mode is used for substituting manual operation of workers, meanwhile, welding and subsequent trimming and encapsulating processes of the accumulator plate pack are finished on the rolling way, so that labor intensity of the workers is reduced, and production efficiency is increased.

The invention discloses a method for welding a lead of diode and a diode. The method comprises the following steps: placing a chip on a welding station of a tube seat, then pressing a lead seat on the chip, and welding the lead seat, the chip and the welding station of the tube seat together by adopting primary welding; and molding and ultrasonically cleaning the station surface after welding, and then encapsulating the whole with epoxy resin. The structure of the diode comprises the tube seat (1) which is connected with the chip (3) and the lead seat (4) in turn; and an epoxy resin sealing layer (5) is arranged outside the chip (3) and the lead seat (4). The method can simplify the welding process, improve the production efficiency and reduce the production cost; and the produced diode has the advantages of low leakage current, low thermal resistance and high voltage resistance, and is not easy to break down.

A chip replacement method disclosed by the present invention is suitable for replacing a ball grid array (BGA) packaging chip, belongs to the mainboard maintenance technology field, and comprises thefollowing steps of providing a ball grid array soldering station; setting a temperature curve that the BGA soldering station works; fixing a mainboard on the BGA soldering station, and aligning a to-be-replaced chip on the mainboard at a wind inlet and a wind outlet of the BGA soldering station; starting the BGA soldering station, enabling the BGA soldering station to heat the to-be-replaced chipaccording to the temperature curve, and operating the BGA soldering station when the actual working temperature of the BGA soldering station and the highest temperature of the temperature curve have the preset temperature difference to enable the BGA soldering station to keep a current working temperature; taking out the to-be-replaced chip from the mainboard, and cleaning the soldering tin on a pad corresponding to the to-be-replaced chip; turning off the BGA soldering station, and placing a substituting chip on the pad; starting the BGA soldering station, and enabling the BGA soldering station to solder the substituting chip on the mainboard according to the temperature curve. The beneficial effects of the above technical scheme are that the BGA chip replacement time is short, the soldering yield is high, and the BGA chip replacement efficiency is improved.

The invention discloses a production method of an infrared light-emitting diode with high-reliability electrodes. The production method includes: providing an epitaxial layer, evaporating a metal reflector on a second-type conducting layer of the epitaxial layer, and bonding the metal reflector on the substrate; removing the epitaxial substrate, and exposing a micro roughening layer; forming roughening morphology on the surface of the micro roughening layer; removing part of the micro roughening layer, producing a bonding pad electrode in the rest area of the micro roughening layer, and exposing an ohmic contact layer in the removed area of the micro roughening layer; forming extension electrode patterns on the surface of the exposed ohmic contact layer; forming the bonding pad electrode and extension electrodes; removing the exposed ohmic contact layer and an corrosion stop layer in a layer-by-layer manner till a roughening layer is exposed; forming surface roughening morphology in the exposed area of the roughening area; evaporating a back electrode on the back of the substrate, and performing fragmentation. By the method, reliability of soldering station electrodes is improved effectively, the problem that soldering station electrodes are prone to falling off due to poor adhesion is solved, and the packaging problem that the epitaxial layer under the soldering station electrodes is easy to break up during wire bonding is solved as well.

The invention provides a touch soldering station and relates to a welding device. The touch soldering station comprises a handle, a casing, a control system arranged in the casing and a temperature controller. The casing comprises a top panel and a front side panel, and a temperature measurement mechanism is arranged in the handle. The touch soldering station is characterized in that a display device is arranged on the outer surface of the front side panel of the casing, and a touch screen is installed on the front surface of the display device. Compared with the prior art, the touch soldering station has the advantages that due to the fact that the touch screen is adopted to replace a mechanical button panel and is a smooth plane and the surface of the touch screen is not provided with other components, the touch soldering station is convenient to operate and simply and attractive in appearance, and due to the fact that a dial plate and a pointer are in a picture displayed by the display device, the problem that a temperature value seen by operators is deviated due to changes of view angles of the operators is solved.

The invention discloses an environment-friendly energy-saving hot air soldering station with an automatic switch, which relates to a hot air soldering station, and is mainly developed to solve the problem that the conventional hot air soldering station has no automatic switch. The automatic switch adopts a form of the interaction of a dry reed pipe and a permanent magnet plus a relay. When the dry reed pipe approaches the permanent magnet of a handle bracket in a handle, a reed of the dry reed pipe is magnetized to make a contact closed, so that a coil of the relay is electrified to actuate, a normally closed contact is disconnected to cut off a thyristor trigger signal, a heating element is switched off to stop heating, a normally open contact of the relay is closed to control an air pump motor for time-delay work at the same time, and the shutdown is performed after the maximum airflow is given to the heating element for heat dissipation; and when the handle leaves the handle bracket, the handle begins to work so as to have the function of the automatic switch. The hot air soldering station has the advantages that: the hot air soldering station can prolong more than one time using period of the heating element, save more than 30 percent of electricity, and also prolong more than one time operation period of hot air soldering stations at the same time.

The invention discloses an infrared light-emitting diode with high-reliability electrodes. A roughening layer is arranged on one side of an epitaxial light-emitting structure, a corrosion stop layer is arranged on the roughening layer, an ohmic contact layer is arranged on the corrosion stop layer, extension electrodes are formed on the surface of the ohmic contact layer, a micro roughening layer is arranged on the ohmic contact layer, and a bonding pad electrode is arranged on the micro roughening layer and connected with the extension electrodes; a metal reflector is arranged on the other side of the epitaxial light-emitting structure, a substrate is arranged on the metal reflector, and a back electrode is arranged on the substrate. Reliability of soldering station electrodes is improved effectively, the problem that soldering station electrodes are prone to falling off due to poor adhesion is solved, and the packaging problem that the epitaxial layer under the soldering station electrodes is easy to break up during wire bonding is solved as well.

The invention discloses a method for manufacturing a light-emitting diode emitting light through an electrode. According to the method, an epitaxy light-emitting structure is formed on an epitaxy of an epitaxy substrate, and a light-pervious channel manufacturing layer is formed on the epitaxy light-emitting structure; a plurality of regular light-pervious channels are formed in an electrode area of the light-pervious channel manufacturing layer by means of a mask and an ICP etching process, and the depth of the portion, undergoing ICP etching, of an electrode area allows the surface of the epitaxy light-emitting structure to be exposed; light-pervious materials are evaporated on the surface of the exposed surface of the epitaxy light-emitting structure until the light-pervious channels are filled with the materials and a light-pervious column is formed; the light-pervious channel manufacturing layer is corroded and removed, the light-pervious column is retained and the epitaxy light-emitting structure is exposed; a soldering station electrode is formed on the surface of the epitaxy light-emitting structure, and the thickness of the solder station electrode is larger than the height of the light-pervious column; the surface of a first electrode or a second electrode which serves as the soldering station electrode is under ICP etching until the upper surface of the light-pervious column is exposed; a back electrode is formed on the epitaxy light-emitting structure, and a light-emitting diode chip is formed on a split sheet. The light blocking area of the soldering station electrode can be reduced, and external quantum efficiency of the light-emitting diode can be improved.

The invention provides a linear module Cartesian coordinate automatic soldering machine, which includes a sealing groove, a placement hole, a hollow cavity, an exhaust pipe, a small air pump, an air intake pipe, an electric telescopic rod, a sealing plate and a welding head, and the placement hole It is set in the middle of the lower end surface inside the sealing groove, and the lower end of the placement hole is connected to the hollow cavity. The small air pump is arranged inside the soldering station, the upper end of the air intake pipe is connected to the hollow cavity, and the lower end of the air intake pipe is connected to a small air exhaust machine. The left end of the exhaust pipe is connected to a small air extractor, and the right end of the exhaust pipe extends to the right side of the soldering station. This design realizes the purpose of the vacuum protection welding head of the present invention. The upper end of the electric telescopic rod is installed on the lower end surface of the slide plate. The lower end of the electric telescopic rod is equipped with a welding head, and the sealing disc is assembled on the upper side of the ring side of the welding head. This design realizes the rapid sealing of the present invention. The present invention has high working effect, long service life, good stability and high reliability. .

The invention discloses a chip welding spot structure, a preparation method thereof and a packaging structure, and relates to the technical field of electronic components, and the preparation method of the chip welding spot structure comprises the steps that a substrate is provided, and the substrate comprises a silicon substrate and a bonding pad formed on the upper surface of the silicon substrate; forming a welding spot prefabricated body on the bonding pad, wherein the welding spot prefabricated body has a columnar structure; a boss welding spot is formed on the welding pad and the welding spot prefabricated body through electroplating, the boss welding spot comprises a first welding table and a second welding table which are of a columnar structure, the first welding table and the second welding table are arranged in a stacked mode in the extending direction of the columnar structure, and the sectional area of the first welding table is smaller than that of the second welding table. According to the chip welding spot structure, the preparation method thereof and the packaging structure provided by the invention, short circuit between the two welding spots during packaging can be prevented, so that the packaging yield of the chip is improved.

The invention discloses a welding station module circulating device, a welding station module and a method for welding a battery string, the welding station module is used for supporting and controlling a welding strip below the unwelded battery string, and an upper-layer transmission mechanism is used for synchronously transmitting the welding station module and the battery string backwards and completing heating and cooling of the battery string, so that the welding strip is fixedly connected with a battery piece; the lower-layer conveying mechanism is used for conveying the welding table module to the front end of the upper-layer conveying mechanism and caching the welding table module; the second transfer mechanism is used for transferring the welding table modules fixedly connected to the upper-layer conveying mechanism to the lower-layer conveying mechanism, and the first transfer mechanism is used for transferring the welding table modules on the lower-layer conveying mechanism to the front end of the upper-layer conveying mechanism to bear the battery strings. Heating and curing of the battery string are separated, heating, curing and battery string laying in the battery string preparation process can be carried out at the same time, the welding time of the battery string is shortened, and the production efficiency of battery string welding is improved.

The invention discloses a soldering station mechanism for a battery assembly. The soldering station mechanism for the battery assembly comprises a linear module, a follow-up linear sliding rail, a moving frame and soldering station assemblies, wherein the linear module and the follow-up linear sliding rail are arranged in parallel; the moving frame is installed on a sliding block of the linear module; the other end of the moving frame is arranged on a sliding block of the follow-up linear sliding rail; the position-adjustable soldering station assemblies are installed on the moving frame in anarray mode; horizontally-arranged adjusting holes are formed in the moving frame at equal intervals; and screws penetrate through the adjusting holes and then are locked onto the soldering station assemblies. By means of the mode, the soldering station is compact in structure, stable in operation, and capable of guaranteeing the stability of a welding rod; a rubber sucking disc downwards moves and retreats so as to be prevented from being damaged by high-temperature welding; the positions of each two adjacent soldering station assemblies is adjustable so as to be capable of being matched withproducts of different sizes, so that the applicability is wide; and a welding point floating structure is arranged in a floating mode, so that a welding head is ensured to make close contact with a welding point without damaging a product.

The invention discloses a large-sized LED with a concealed extension electrode. The large-sized LED includes an epitaxial structure, a second electrode, and a first electrode composed of a solder padelectrode connected to a metal extension electrode. The epitaxial structure includes a substrate, a second type of conductive layer, an active layer and a first type of conductive layer. The second type of conductive layer is electrically connected to the second electrode. A groove is formed in the first type of conductive layer. The side walls of the groove form metal extension electrode layers.The metal extension electrode layers of the adjacent side walls are continuous with each other. The solder pad electrode is arranged in the groove. The solder pad electrode and the metal extension electrode layers are electrically connected to each other. The invention also discloses a manufacturing method of the LED. A special groove structure is provided to achieve an effect of uniformly expanding the current. The extension electrode has an extremely low thickness, and is arranged on the vertical surface on the side of the groove, which is equivalent to being invisible. The large-sized LED solves the problem that the bottom surface of a metal extension electrode in the prior art shields light, and realizes a wide range of light emitting area, thereby maintaining a superior current spreading effect.

The invention provides a combined pressure welding station and an automatic pressure welding machine equipped with the pressure welding station. The combined pressure welding station includes: a fixed platform formed with a height difference between the first surface supporting the pressure-bearing surface of the connector housing and the second surface of the staggered locking part; a connector housing formed with an opening for supporting the joint connection part The third surface of the joint connection part of the connection surface and the fourth surface of the connection part of the connector shell surface supporting the opening of the wire insertion port; the movable platform that is arranged on the fixed platform and presses the wire lead-out surface of the connector shell and puts the The connector housing is pressed into the brake mechanism in the third surface, and the movable platform can leave the fixed platform in the height direction.

The invention discloses a temperature control system of a soldering station. The system comprises a terminal, a server and more than two soldering stations, wherein each soldering station comprises asoldering tin module, a master control module, a parameter setting module, a storage module and a communication module, the master control modules are in communication connection with the server and are positioned in the soldering stations so as to process soldering station data and issue an instruction; the soldering tin modules, the parameter setting modules, the storage modules and the communication modules are all in communication connection with the master control modules; the terminal comprises a mobile phone, a computer and the like and realizes communication with the server through APP; due to the arrangement of the parameter setting module and the storage module on each soldering station, the regulation and the storage of parameters when the soldering station works are realized, the arrangement of the communication modules between the soldering stations realizes information transmission between the soldering stations, and a function of transmitting the information of one soldering station to other soldering stations is realized so as to be convenient for setting parameters for two soldering stations or above.