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A chip replacement method

A replacement method and chip technology, which is applied in the field of chip replacement for solder ball array packaged chips, can solve the problems of long BGA chip time consumption and low soldering pass rate, and achieve the effects of short replacement time, high soldering yield, and improved efficiency

Active Publication Date: 2020-08-04
AMOLOGIC (SHANGHAI) CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] According to the above-mentioned problems existing in the prior art, a chip replacement method suitable for replacing solder ball array packaged chips is now provided, aiming at solving the problems of long time-consuming replacement of BGA chips and low soldering pass rate in the prior art

Method used

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Embodiment Construction

[0032] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

[0033] In a preferred embodiment of the present invention, such as Figure 1-3 As shown, a chip replacement method is provided, which is suitable for replacing a ball array package chip, including the following steps:

[0034] Provide a BGA soldering station for soldering ball array packaged chips;

[0035] Step S1, setting the working temperature curve of the BGA soldering station;

[0036] Step S2, fixing the main board on the BGA soldering station, and aligning the chip to be replaced on the main board with the upper air outlet and the lower air outlet of the BGA soldering station, and the temperature of the upper hot air output by the upper air outlet is lower than that output by the lower air outlet The temperature of the lower hot air;

[0037] Step S3, start the BGA soldering station, t...

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Abstract

A chip replacement method disclosed by the present invention is suitable for replacing a ball grid array (BGA) packaging chip, belongs to the mainboard maintenance technology field, and comprises thefollowing steps of providing a ball grid array soldering station; setting a temperature curve that the BGA soldering station works; fixing a mainboard on the BGA soldering station, and aligning a to-be-replaced chip on the mainboard at a wind inlet and a wind outlet of the BGA soldering station; starting the BGA soldering station, enabling the BGA soldering station to heat the to-be-replaced chipaccording to the temperature curve, and operating the BGA soldering station when the actual working temperature of the BGA soldering station and the highest temperature of the temperature curve have the preset temperature difference to enable the BGA soldering station to keep a current working temperature; taking out the to-be-replaced chip from the mainboard, and cleaning the soldering tin on a pad corresponding to the to-be-replaced chip; turning off the BGA soldering station, and placing a substituting chip on the pad; starting the BGA soldering station, and enabling the BGA soldering station to solder the substituting chip on the mainboard according to the temperature curve. The beneficial effects of the above technical scheme are that the BGA chip replacement time is short, the soldering yield is high, and the BGA chip replacement efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of mainboard maintenance, in particular to a chip replacement method suitable for replacing solder ball array packaged chips. Background technique [0002] With the continuous development of BGA devices (ball grid array package devices), the market demand increases and the product production capacity continues to increase. It is difficult for SMT placement technology to avoid the emergence of defective BGA chips. Due to the high price of BGA chips, it is necessary to rework and replace BGA chips in order to reduce costs and improve product yield. At present, the industry usually uses the following two solutions to replace BGA chips: [0003] Option 1: use BGA soldering station: it takes about 4 minutes to remove the BGA chip by heating; it takes about 12 minutes to remove the motherboard after the BGA soldering station returns to normal temperature, and use electric chromium iron and tin suction tape to cle...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34
CPCH05K3/3436H05K2203/176
Inventor 甘万勇许传停樊强李妹张坤
Owner AMOLOGIC (SHANGHAI) CO LTD
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