A method for manufacturing a high-precision mini
LED circuit board involves: pre-enlarging one side of a first
copper layer to a thickness greater than the designed thickness; sequentially attaching an
adhesive layer and a support layer to one side of the first
copper layer; partially
etching the corresponding pad pattern on the other side to form a semi-etched groove; then silkscreening
solder paste and
polishing to form the pads; taking a first single-sided
copper-clad laminate composed of an insulating
dielectric layer and a second copper layer, stacking and pressing the sides of the insulating
dielectric layer corresponding to the pads to form a laminated board; sequentially removing the pre-enlarged area, support layer, and
adhesive layer from the laminated board to create surface circuit patterns, followed by subsequent
processing to form the circuit board; by using a thick copper layer to replace the designed copper layer, and constructing a reverse
processing structure with
adhesive and support
layers, the pads are reverse-formed on the insulating
dielectric layer, and the circuit patterns are simultaneously reverse-formed, avoiding the hemispherical protrusion problem of the solder surface caused by solder spraying, providing a high-quality substrate for subsequent LED
chip soldering, and effectively reducing the hidden dangers of cold solder joints and poor contact.