Silver copper diffusion welding method and device

A diffusion welding and welding device technology, applied in auxiliary devices, welding equipment, welding equipment, etc., can solve the problems of easy introduction of pinholes or leakage welding, micro-channel blockage, micro-channel deformation, etc., to achieve good welding quality and reliability. , avoid oxidation, improve the effect of welding quality
CN104874932AInactive Publication Date: 2015-09-02INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
Publication Date
2015-09-02
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides a novel silver copper diffusion welding method and a welding device used by same. The method and the welding device can integrally weld a plurality of thin plates or micro radiating graphics by a heat sink manner, have the advantages of being simple in method, high in welding yield, good in welding quality and good in reliability, and are mainly applied to water-based heat sink in refrigerating of a power type electronic element, a laser or an optical gain medium and mass production of bases.
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Description

technical field

[0001] The invention relates to packaging technology in the field of electronics and optoelectronics, especially for the preparation of copper (or oxygen-free copper) heat dissipation base or heat sink required for heat source cooling in high-power systems including power electronic components, semiconductor lasers, and solid-state laser systems The welding method and welding equipment used in the process. Background technique

[0002] Heat sources in high-power systems often generate a lot of waste heat, such as the active region in semiconductor lasers, the gain medium (crystal) of solid-state lasers, etc. These heat need to be dissipated through a reasonable heat dissipation path, otherwise it will affect the performance of the entire system It is one of the commonly used methods to use high thermal conductivity materials such as copper and oxygen-free copper as the base or heat sink to conduct liquid convection conduction cooling on the heat source. In o...

Claims

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