Silver copper diffusion welding method and device

A diffusion welding and welding device technology, applied in auxiliary devices, welding equipment, welding equipment, etc., can solve the problems of easy introduction of pinholes or leakage welding, micro-channel blockage, micro-channel deformation, etc., to achieve good welding quality and reliability. , avoid oxidation, improve the effect of welding quality

Inactive Publication Date: 2015-09-02
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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AI Technical Summary

Problems solved by technology

As the demand for heat dissipation capacity continues to increase and the volume of heat sinks continues to shrink, the concept of micro-channels is often introduced in the design of water channels. The size of this heat dissipation channel is about 100um, and the heat sink carrying the micro-channels is relatively thin. If you continue to use The usual silver-copper welding method will deform or even melt the microchannel during the welding process, and it is easy to introduce pinholes or missing welding parts after welding, resulting in water leakage
In addition, due to the small size of the micro-channel structure, it will produce a "siphon" phenomenon after the solder melts, causing the micro-channel to be blocked

Method used

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  • Silver copper diffusion welding method and device
  • Silver copper diffusion welding method and device
  • Silver copper diffusion welding method and device

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Embodiment Construction

[0043] see figure 1 , figure 1 The flow chart of the novel silver-copper diffusion welding method provided by the invention, the method may further comprise the steps:

[0044] Step 101: Perform chemical cleaning on all parts to remove oil stains and oxide layers;

[0045] Step 102: coating a layer of silver on the surface of the specific part;

[0046] Step 103: Arranging all the parts in order, and clamping them on the welding device;

[0047] Step 104: Put the entire jig with the heat sink installed into a furnace made of fused silica glass, and fill it with inert gas or hydrogen for protection;

[0048] Step 105: Heating the furnace to about 800 degrees Celsius and keeping the temperature constant for 15 minutes, so that the silver and copper molecules diffuse each other to form an alloy layer, and fill it with inert gas or hydrogen for protection;

[0049] Step 106: Stop heating, naturally cool to room temperature, and fill with inert gas for protection;

[0050] Ste...

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Abstract

The invention provides a novel silver copper diffusion welding method and a welding device used by same. The method and the welding device can integrally weld a plurality of thin plates or micro radiating graphics by a heat sink manner, have the advantages of being simple in method, high in welding yield, good in welding quality and good in reliability, and are mainly applied to water-based heat sink in refrigerating of a power type electronic element, a laser or an optical gain medium and mass production of bases.

Description

technical field [0001] The invention relates to packaging technology in the field of electronics and optoelectronics, especially for the preparation of copper (or oxygen-free copper) heat dissipation base or heat sink required for heat source cooling in high-power systems including power electronic components, semiconductor lasers, and solid-state laser systems The welding method and welding equipment used in the process. Background technique [0002] Heat sources in high-power systems often generate a lot of waste heat, such as the active region in semiconductor lasers, the gain medium (crystal) of solid-state lasers, etc. These heat need to be dissipated through a reasonable heat dissipation path, otherwise it will affect the performance of the entire system It is one of the commonly used methods to use high thermal conductivity materials such as copper and oxygen-free copper as the base or heat sink to conduct liquid convection conduction cooling on the heat source. In o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K31/02B23K37/00B23K37/04
CPCB23K31/02B23K37/00B23K37/0435B23K2103/08B23K2103/12
Inventor 刘媛媛柳瑞从杨富华
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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