Intelligent power module and manufacturing method thereof

Abstract

The invention is suitable for the technology of electronic devices, and provides an intelligent power module and a manufacturing method thereof. The intelligent power module comprises a metal substrate of which one surface is covered with an insulating layer; a circuit wiring layer which is formed on the surface of the insulating layer; multiple IGBT tubes which are arranged on the preset positions of the circuit wiring layer; gate electrode drive tubes which are identical with the IGBT tubes in number, wherein each gate electrode drive tube respectively acts as a drive circuit for the corresponding IGBT tube, and the drive end of each gate electrode drive tube is the same with wiring length of gate electrode electric connection of the IGBT tubes; and a metal wire which is connected between the circuit wiring layer, the IGBT tubes and the gate electrode drive tubes so that a preset circuit is formed. Wiring from the gate electrode drive tubes to the IGBT tube gate electrodes is ensured to be identical so that dynamic characteristics of the IGBT tubes are enabled to be identical without additional arrangement of wiring of the intelligent power module.

Description

technical field [0001] The invention belongs to the field of electronic device manufacturing technology, and in particular relates to an intelligent power module and a manufacturing method thereof. Background technique [0002] Intelligent Power Module (IPM) is a power drive product that combines power electronics and integrated circuit technology. IPM integrates power switching devices and high-voltage drive circuits, and has built-in fault detection circuits such as overvoltage, overcurrent and overheating. On the one hand, the IPM receives the control signal from the MCU (Microprogrammed Control Unit, microprogram controller) to drive the subsequent circuit to work, and on the other hand, sends the system status detection signal back to the MCU. Compared with the traditional discrete solution, IPM wins more and more markets with its advantages of high integration and high reliability. It is especially suitable for frequency converters and various inverter power supplies ...

AI Technical Summary

Problems solved by technology

[0010] It can be seen from Figure 1 (C) that the current intelligent power module is controlled by 6 IGBT tubes by 1 HVIC tube, which leads to long wiring and easy interference between lines; The distance is not the same, which makes it difficult to control the sameness of the driving signal transmission of the six IGBT tubes; in addition, because too many circuit wirings on the substrate will inevitably increase the area of ​​the substrate, resulting in an increase in the area of ​​the current intelligent power module, which increases the power of the intelligent power module. The manufacturing cost affects the popularity of smart power modules in the low-end field; in addition, due to the need to reserve a circuit wiring area, the distance between components is relatively large, and the wires connecting components through metal wires are relatively long, which affects the The reliability of the state line, and there is a risk of causing line punching during the molding process

Images