Method for improving welding performance of copper surface heat sink for packaging shell after gold plating

A technology for encapsulation and welding performance, applied in the field of surface treatment, to achieve the effect of improving welding performance, no environmental pollution, welding performance and welding yield improvement

A technology for encapsulation and welding performance, applied in the field of surface treatment, to achieve the effect of improving welding performance, no environmental pollution, welding performance and welding yield improvement

CN110528038AActive Publication Date: 2019-12-03CETC GUOJI SOUTHERN GRP CO LTD
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  • Method for improving welding performance of copper surface heat sink for packaging shell after gold plating

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Embodiment 1

[0039] A method for improving soldering performance after gold-plated copper surface heat sink for encapsulation shell, comprising the following steps:

[0040] ① Alkaline degreasing: Alkaline degreasing is an aqueous solution, which contains 40 g / L chemical degreasing powder. Put the brazed semi-finished product shell into the alkaline degreasing solution at 60 ° C for 5 minutes, and use tap water after degreasing Rinse and rinse with deionized water;

[0041] ② Pickling: The pickling solution is an aqueous solution, which contains: 5mL / L OP emulsifier, 75g / L thiourea, and 100mL / L sulfuric acid. Put the washed shell into the pickling solution at 60°C for 5 minutes. After pickling, rinse with tap water first, and then clean with deionized water;

[0042] ③ Etching: The etching solution is an aqueous solution, which contains: 100mL / L pickling agent A, 200mL / L pickling agent B, 10mL / L oxidizing agent, 20g / L corrosion inhibitor, and the temperature of the solution is 40°C , soa...

Embodiment 2

[0050] A method for improving soldering performance after gold-plated copper surface heat sink for encapsulation shell, comprising the following steps:

[0051] ① Alkaline degreasing: Alkaline degreasing is an aqueous solution, which contains 60 g / L chemical degreasing powder. Put the brazed semi-finished shell in an alkaline degreasing solution at 80°C for 15 minutes. After degreasing, use tap water first. Rinse and rinse with deionized water;

[0052] ② Pickling: The pickling solution is an aqueous solution, which contains: 10mL / L OP emulsifier, 150g / L thiourea, and 200mL / L sulfuric acid. Put the washed shell into the pickling solution at 80°C for 15 minutes. After pickling, rinse with tap water first, and then clean with deionized water;

[0053] ③ Etching: The etching solution is an aqueous solution, which contains: 300mL / L pickling agent A, 400mL / L pickling agent B, 50mL / L oxidizing agent, 60g / L corrosion inhibitor, and the temperature of the solution is 60°C , soak the...

Embodiment 3

[0061] A method for improving soldering performance after gold-plated copper surface heat sink for encapsulation shell, comprising the following steps:

[0062] ① Alkaline degreasing: Alkaline degreasing is an aqueous solution, which contains 50 g / L chemical degreasing powder. Put the brazed semi-finished shell in the alkaline degreasing solution at 70 ° C for 10 minutes, and then use tap water after degreasing Rinse and rinse with deionized water;

[0063] ②Pickling: The pickling solution is an aqueous solution, which contains: 8mL / L OP emulsifier, 110g / L thiourea, and 150mL / L sulfuric acid. Put the washed shell into the pickling solution at 70°C for 10 minutes. After pickling, rinse with tap water first, and then clean with deionized water;

[0064] ③ Etching: The etching solution is an aqueous solution, which contains: 200mL / L pickling agent A, 300mL / L pickling agent B, 30mL / L oxidizing agent, 40g / L corrosion inhibitor, and the temperature of the solution is 50°C , soak t...

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Abstract

The invention discloses a method for improving the welding performance of a copper surface heat sink for a packaging shell after gold plating. The method comprises the following steps of putting the shell into an alkaline oil removal solution to be cleaned; putting the shell into a pickling solution for cleaning; putting the shell into an etching solution for treatment; putting the shell into a pickling solution for cleaning; putting the shell into an activation solution for pre-plating activation; electroplating a layer of thin nickel on the surface of the shell; electroplating a layer of thick nickel on the surface of the shell; electroplating a layer of thick gold on the surface of the shell; and carrying out high-temperature drying treatment on the washed shell by using a high-temperature blast drying box. According to the invention, etching before plating is carried out on the copper surface heat sink for the packaging shell, etching liquid is corroded along a grain boundary, so that a lattice pattern shape is formed on the copper surface, and after nickel plating and gold plating are subsequently carried out on the basis, the welding performance and the welding yield of the surface of the copper surface heat sink are greatly improved; the etching solution corrodes along the grain boundary, other areas of the copper surface and other materials of the shell are not damaged,and the etching time range is large.

Description

technical field [0001] The invention belongs to the technical field of surface treatment, in particular to a method for improving the soldering performance after heat sink gold plating on the copper surface of a packaging shell. Background technique [0002] Copper surface heat sink materials, common heat sink materials such as oxygen-free copper, copper-molybdenum-copper, copper-molybdenum-copper-copper, copper-tungsten copper-copper and surface copper-clad skin, are known for their high thermal conductivity and low thermal expansion With the advantages of low coefficient and easy processing, it has become an ideal heat sink material for electronic packaging, and it is a research hotspot in the field of packaging materials. Especially for the packaging of high-power devices, its high thermal conductivity meets the requirements of instant, rapid and large-scale heat dissipation. Adding a relatively small amount of low thermal expansion phase can obtain a thermal expansion co...

Claims

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Application Information

Patent Timeline
03 Dec 2019
Publication
CN110528038A
IPC
C25D5/34; C25D5/14; C23F1/18; C23G1/10; C25D3/12; C25D3/48
CPC
C23F1/18; C23G1/103; C25D3/12; C25D3/48; C25D5/14; C25D5/34
Inventors
解瑞; 刘海