Multilayered ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON
A technology of electronic components and multilayer capacitors, applied in the direction of electrical components, laminated capacitors, fixed capacitor electrodes, etc., can solve problems such as faults, sensor faults, and reduced device quality
Active Publication Date: 2021-01-19
SAMSUNG ELECTRO MECHANICS CO LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0005] When the operating environment of the device is quiet, this acoustic noise may be perceived by the user as an abnormal sound and regarded as a malfunction of the device
[0006] Additionally, in devices with speech circuitry, acoustic noise may be superimposed on the speech output to degrade the quality of the device
[0007] In addition, in addition to the acoustic noise perceived by the human ear, when the piezoelectric vibration of the multilayer capacitor is generated in the high-frequency region of 20kHz or higher, They can cause malfunction of various sensors used in IT and industrial / electrical fields
Method used
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[0037] The following detailed description is provided to assist the reader in gaining an overall understanding of the methods, devices and / or systems described herein. However, various changes, modifications, and equivalents of the methods, devices, and / or systems described herein will be apparent to those of ordinary skill in the art. The order of operations described herein is merely an example and is not limited to the order set forth herein, but changes may be made that will be apparent to those of ordinary skill in the art, except for operations that must occur in a particular order. Also, descriptions of functions and constructions that are well known to one of ordinary skill in the art may be omitted for increased clarity and conciseness.
[0038] The features described herein may be implemented in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein have been provided so that this disclosure wil...
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Abstract
The present invention provides a multilayered electronic component and a board having the same mounted thereon. The multilayered electronic component comprises: a multilayered capacitor including a capacitor body and a plurality of external electrodes disposed to be spaced apart from each other on the mounted surface of the capacitor body; and a connection terminal including land units disposed oneach external electrode. When defining the thickness of the multilayered capacitor as T1 and the distance from an upper end of the external electrode to a lower end of the connection terminal as T2,T1 / T2 is 0.6 to 0.9.
Description
[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2019-0086596 filed with the Korean Intellectual Property Office on July 17, 2019, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0002] The present disclosure relates to a multilayer electronic component and a board on which the multilayer electronic component is mounted. Background technique [0003] As a type of multilayer electronic component, a multilayer capacitor is formed using a dielectric material, and the dielectric material is piezoelectric and thus deforms in synchronization with an applied voltage. [0004] When the frequency of the applied voltage is in the audible frequency band, the displacement of the capacitor body becomes vibration and is transmitted to the substrate through the solder, and the vibration of the substrate may be audible. This sound is called acoustic noise. [0005] When the operating environment of t...
Claims
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IPC IPC(8): H01G4/224H01G4/236H01G4/30
CPCH01G4/302H01G4/30H01G4/224H01G4/236H01G2/065H01G4/005H01G4/232Y02P70/50H01G4/1209
Inventor 朴兴吉朴世训朴宪奎申旴澈赵志弘
Owner SAMSUNG ELECTRO MECHANICS CO LTD