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Chemical vapor deposition shower head for uniform gas distribution

A chemical vapor deposition, gas distribution technology, applied in gaseous chemical plating, electrical components, coatings, etc., can solve the problems of reduced manufacturing yield, influence, deposition film defects, etc.

Pending Publication Date: 2021-01-22
LAM RES CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, some properties of the film deposited on the substrate may be non-uniform
Additionally, deposited films are susceptible to defects at the location of the stagnant gas flow
Defects are problematic for certain types of substrates, such as semiconductor substrates, as they can lead to useless dies, reducing manufacturing yields

Method used

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  • Chemical vapor deposition shower head for uniform gas distribution
  • Chemical vapor deposition shower head for uniform gas distribution
  • Chemical vapor deposition shower head for uniform gas distribution

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Embodiment Construction

[0017] The application will now be described in detail with reference to several non-exclusive embodiments as shown in the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present disclosure may be practiced without some or all of these specific details. In other instances, well-known process steps and / or structures have not been described in detail in order not to obscure the present disclosure.

[0018] refer to figure 1 , a block diagram of a chemical vapor deposition (CVD) tool 10 is shown. The CVD tool 10 includes a processing chamber 12 , a showerhead 14 , a substrate holder 16 for holding and positioning a substrate 18 to be processed, a radio frequency (RF) generator 20 , and a system controller 22 . In many embodiments, the CVD tool can be plasma enhanced (PECVD), low pressure (LPCVD), ul...

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Abstract

A Chemical Vapor Deposition (CVD) tool providing more even flow and distribution of reagent gasses over a substrate. The CVD tool includes a processing chamber and a shower head. The shower head includes a gas dispensing surface having multiple hole patterns that are preferably, but not exclusively, non-symmetrical patterns that mitigate or eliminate lines or symmetry. Such hole patterns include are a variety of different types of spirals or close approximations thereof, include, but are not limited to, Archimedean, Vogel or Fermat spirals.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to U.S. Patent Application No. 16 / 006,591, filed June 12, 2018. It is hereby incorporated by reference for all purposes. Background technique [0003] Chemical vapor deposition (CVD) tools are used to deposit thin films on substrates. One type of CVD tool, known as a plasma enhanced CVD or "PECVD" tool, includes a processing chamber, a substrate holder for positioning a substrate in the processing chamber, and a showerhead. During operation, the showerhead distributes reactant gases over the surface of the substrate to be processed. A radio frequency (RF) potential is applied to the showerhead, and possibly also to the substrate holder, to generate a plasma. The excited electrons ionize or dissociate (ie, "crack") the reactant gases in the plasma, thereby producing chemically reactive free radicals. When these radicals react, they deposit and form thin films on the substrate. [0004...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/455C23C16/52C23C16/505
CPCC23C16/45565C23C16/45574C23C16/50H01J37/3244H01J37/32449C23C16/45561C23C16/52C23C16/505
Inventor 安德鲁·詹姆斯·波尔斯迈克尔·约翰·塞勒普约翰·迈克尔·威尔特斯达米安·马丁·斯莱文埃里克·马德森
Owner LAM RES CORP