Shaping device for bagged FOSB packaging bags

Abstract

The invention discloses a shaping device for bagged FOSB packaging bags. The shaping device comprises a shaping machine frame, a sealing machine frame, a FOSB conveying belt, a vacuumizing device, anopening clamping device, an ultrasonic sealing device, a FOSB front-end upturning device, a FOSB front-end shaping device, a sealing station horizontal driving device and a FOSB back side surface shaping device. The FOSB conveying belt, the FOSB front-end shaping device and the FOSB back side face shaping device are installed on the shaping machine frame, the sealing station horizontal driving device is arranged on the ground on one side of the shaping machine frame, the sealing machine frame is fixed to the movable end of the sealing station horizontal driving device, and the FOSB front-end upturning device, the vacuumizing device, the opening clamping device and the ultrasonic sealing device are all fixed to the sealing machine frame. According to the shaping device for the bagged FOSB packaging bags, the bagged FOSB packaging bags can be vacuumized and automatically shaped, the shaping efficiency is improved, the whole process is fully automatically carried out, and the labor cost is reduced.

Description

technical field [0001] The invention relates to the field of FOSB packaging, and more specifically relates to a shaping device for FOSB packaging bags after bagging. Background technique [0002] Wafer refers to a silicon chip made of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. A wafer is a carrier used in the production of integrated circuits. A wafer in the general sense basically refers to It is a single crystal silicon wafer. The single crystal silicon wafer is refined from ordinary silicon sand. After being dissolved, purified, and distilled, it supports a single crystal silicon rod. After the single crystal silicon rod is polished and sliced, it becomes a wafer. With the continuous development of integrated circuit manufacturing technology, the feature size of the chip is getting smaller and smaller, the number of interconnection layers is increasing, and the diameter of the wafer is also increasing. To achieve multi-...

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