A bomb-borne, airborne, and vehicle-mounted data processing printed board

Abstract

The invention discloses a missile-borne, airborne, and vehicle-mounted data processing printed board. The data processing printed board is arranged in the crust of the whole machine, including a first PCB board provided with an FPGA, and the first PCB board is provided with a hollow area. The hollow area is provided with a second PCB board, and an isolation strip is filled between the second PCB board and the first PCB board; the ADC chip, the radio frequency connection head seat and the connection module are arranged on the second PCB board; the analog ground of the ADC chip passes through the first PCB board A jumper wire is connected to the ground shell of the whole machine; the digital ground of the ADC chip is connected to the ground position of the first PCB board through the second jumper wire; the second jumper wire crosses the isolation zone and bridges the second PCB board and the first PCB board The connection module of the board; the digital ground of the FPGA is connected with the ground position of the first PCB board, and the ground position of the first PCB board is connected to the ground shell of the whole machine. The purpose of the present invention is to provide a bomb-borne, airborne, and vehicle-mounted data processing printed board, which can effectively reduce the background noise glitch signal by separately leading the analog ground of the ADC chip to the whole machine.

Description

technical field [0001] The present invention relates to the technical field of intermediate frequency processing modules, in particular to a bomb-borne, airborne, and vehicle-mounted data processing printed board. Background technique [0002] The intermediate frequency processing module is used for radar target analog signal processing, and its main features are high-speed data sampling and storage, unilateral modulation technology and instantaneous AGC technology. [0003] In the prior art, such as figure 1 As shown, the digital ground of the FPGA, the digital ground of the ADC chip, and the analog ground of the ADC chip are connected together through metallized holes, that is, the digital ground of the FPGA, the digital ground of the ADC chip, and the analog ground of the ADC chip are set together. External signals will interfere with the analog signal. Therefore, a shielding box is added on the PCB of the intermediate frequency processing module, and the digital ground ...

AI Technical Summary

Problems solved by technology

[0004] However, there will be a small amount of background noise in the actual use process. The appearance of background noise will not only lead to signal recognition errors, but also affect the judgment of the reference signal.

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