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AOI special scanning operation method

A kind of operation and special technology, which is applied in the direction of measuring device, material analysis through optical means, instruments, etc., can solve the problems of scanning limitations, single operation mode, and long time consumption, so as to save manpower and time, meet inspection requirements, save the effect of time

Pending Publication Date: 2021-04-23
JIANGSU UNION SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for AOI special scanning operation to solve the above background technology. The existing AOI scanning operation performs 100% inspection on the front of Wafer, but the ope

Method used

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Example Embodiment

[0025]Next, the technical scheme in the embodiment of the present invention will be described in conjunction with the embodiment of the present invention, which is apparent from the embodiments of the present invention, and not all of the embodiments of the invention, not all of the embodiments of the invention. Based on the embodiments of the present invention, there are all other embodiments obtained without making creative labor without making creative labor premises.

[0026]The present invention provides the following technical solutions:

[0027]A method of AOI special scanning operation, the AOI special scanning operation includes the following steps:

[0028]Step 1: AOI scan comparison, the AOI scan contrast includes the reference point alignment and the original file and the production file comparison, the original file and production file contrast includes, according to the PCB design and original file puzzle, and the layout method and The AOI scanning board is the same, and the or...

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Abstract

The invention discloses an AOI special scanning operation method. The method comprises the following steps: 1, carrying out the AOI scanning comparison which comprises the reference point alignment and the comparison of an original file and a production file, and the comparison of the original file and the production file comprises the steps: splicing the original file according to the PCB design, and carrying out the board splicing of the original file before adjustment; comprehensively scanning the scanning area (not distinguishing the PL area); 2, scanning results are subjected to regional inspection; 3, carrying out adjustment by using an Edit Map; 4, comparing operation processes; 5, adjusting Map to work in special areas according to different inspection requirements of customers; 6, selecting effective area scanning operation for Map frames; and 7, performing AOI scanning to obtain a final result. According to the AOI special scanning operation method, the operation modes can be diversified, the Wafer can be subjected to regional scanning, and for abnormal regional scanning, the time is effectively saved, the efficiency is improved, and different inspection requirements of customers can be met.

Description

technical field [0001] The invention relates to the technical field of AOI scanning, in particular to a method for special AOI scanning operations. Background technique [0002] The principle of AOI detection is to use camera technology to output the reflected light intensity of the detected object as a quantitative gray scale value, and compare it with the gray scale value of the standard image to analyze and determine the defect and classify the process. AOI scanning detection technology is an electronic Component integration and refinement are high, detection speed and efficiency are higher, and the development needs of zero-defect detection. AOI scanning detection is not just a detection equipment. It can classify and count a large number of bad results to find the cause of the bad occurrence. It is also gradually playing a more important role in process improvement and production yield improvement. [0003] The existing AOI scanning operation conducts 100% inspection o...

Claims

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Application Information

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IPC IPC(8): G01N21/95
CPCG01N21/9501
Inventor 刘磊高美山姜红涛
Owner JIANGSU UNION SEMICON