Laser cutting device and cutting method for profiled bar

A technology of laser cutting and laser cutting head, which is applied in the direction of laser welding equipment, metal processing equipment, welding equipment, etc., can solve the problems of poor edge quality of laser processing, difficulty in variable section cutting, deep groove cutting interference, etc., and achieve processing efficiency , avoid hanging slag, and achieve the effect of quality

Active Publication Date: 2021-07-09
HUNAN UNIV
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  • Application Information

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Problems solved by technology

[0004] In order to solve the problems such as difficulty in variable section cutting, deep groove cutting interference, and poor edge quality of laser processing in laser cutting of profiled aluminum doors and windows, the present invention proposes to keep the

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  • Laser cutting device and cutting method for profiled bar
  • Laser cutting device and cutting method for profiled bar
  • Laser cutting device and cutting method for profiled bar

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Example Embodiment

[0035] Attached to the following Figure 1-3 Specific embodiments of the present invention are described in detail.

[0036] like Figure 1-2 As shown, this embodiment provides a laser cutting device for profiles, including a chiller 1, a laser 2, a gas source 3, a laser cutting head 4, a fast-forward axis 5 of the laser cutting head, a scanning lens 6, a profile fixture 8, Ultrasonic auxiliary generating device 9 , machine bed 10 , control panel 11 .

[0037] Among them: the chiller 1 is connected to the laser cutting head 4 through a waterway to cool the laser cutting head lens and prevent the lens from fogging; the laser 2 is connected to the laser cutting head 4 through an optical fiber to provide a laser light source for laser cutting, and the gas source 3 can be a gas tank or The air pump is provided and connected to the laser cutting head 4 through the pipeline to blow away the slag and protect the lens during laser cutting. The laser cutting head 4 is connected to th...

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Abstract

The invention discloses a laser cutting device for a profiled bar. The laser cutting device for the profiled bar comprises a cooling-water machine (1), a laser (2), an air source (3), a laser cutting head (4), a laser cutting head fast forward shaft (5), a scanning lens (6), a profiled bar clamp (8), an ultrasonic auxiliary generating device (9), a machine tool body (10) and a control panel (11). The invention further discloses a laser cutting method for the profiled bar. The laser cutting method for the profiled bar aims at the characteristics of complex change of the section shape and the wall thickness of the profiled bar and the machining requirement for a large number of deep groove type holes, the laser cutting speed is matched on the basis of full-power laser energy output according to the change of the thickness and the shape of the section contour, and therefore the machining efficiency is maximized. Meanwhile, an optical module in the laser cutting head of the device adopts a long-focus focus lens, and is matched with a long taper sleeve, so that active anti-interference machining of the deep groove type holes is realized.

Description

technical field [0001] The invention belongs to the technical field of laser cutting, and in particular relates to a laser cutting device and a cutting method for profiled materials. Background technique [0002] There are many kinds of profiles and complex structures, and the efficiency of traditional cutting processing methods is very low. Laser cutting is a method of cutting workpieces with high-power-density laser beams. It has the advantages of fast processing speed and good processing quality. It is an ideal solution for processing special-shaped materials. [0003] When conventional laser cutting is processing workpieces, it is necessary to change the laser output power according to the cutting speed, so as to meet the matching between power and speed to prevent over-burning during processing, but adjusting the laser power according to the processing speed cannot be realized in the entire processing process. The full power output of the laser is a waste of laser powe...

Claims

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Application Information

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IPC IPC(8): B23K26/38B23K26/046B23K26/70
CPCB23K26/38B23K26/702B23K26/703B23K26/046
Inventor 姜潮李伟陈启迪罗红平肖耘亚李章辉
Owner HUNAN UNIV
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