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Pickup assembly for microphone, bone conduction microphone and electronic product

A microphone and bone conduction technology, applied in the field of microphones, can solve problems such as the unsatisfactory effect of shielding sound wave transmission, and achieve the effect of improving the vibration pickup effect and the flat diaphragm.

Pending Publication Date: 2021-07-20
GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the bone conduction microphone transmits sound through the bone, it is necessary for the sound pickup component to shield the part of the sound wave transmission in order to achieve a better sound transmission effect, but the effect of shielding the sound wave transmission of the current bone conduction microphone is not ideal

Method used

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  • Pickup assembly for microphone, bone conduction microphone and electronic product
  • Pickup assembly for microphone, bone conduction microphone and electronic product
  • Pickup assembly for microphone, bone conduction microphone and electronic product

Examples

Experimental program
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Embodiment Construction

[0037] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0038] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0039] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0040] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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PUM

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Abstract

The invention discloses a pickup assembly for a microphone. The pickup assembly comprises a columnar conducting ring, a vibrating diaphragm, a mass block and a polar plate, the vibrating diaphragm is tightened on one end face of the columnar conducting ring; the mass block is adhered to the center of the vibrating diaphragm, an exhaust structure is arranged on one side, attached to the vibrating diaphragm, of the mass block, and the exhaust structure is configured to be capable of exhausting gas between the mass block and the vibrating diaphragm; the polar plate and the vibrating diaphragm are insulated to form a variable capacitor; and the polar plate and the columnar conducting ring are positioned on different sides of the vibrating diaphragm. According to the microphone, the mass block is arranged on the pickup assembly, and the exhaust structure is arranged on the mass block, so that the vibration pickup effect of the microphone is improved.

Description

technical field [0001] The present invention relates to the technical field of microphones, and more specifically, to a sound pickup assembly for a microphone, a bone conduction microphone and electronic products. Background technique [0002] The electret microphone is a form of microphone that uses a variable capacitor as a sound pickup component, while the electret bone conduction microphone uses bone conduction technology to collect sound through a variable capacitor, and the sound wave is transmitted to the microphone through the vibration of the bone. The steps of traditional sound wave transmission are omitted, and clear sound reproduction can be achieved in noisy environments. [0003] The sound transmission effect of the electret bone conduction microphone depends largely on the sound pickup components and the internal structure of the microphone. Since the bone conduction microphone transmits sound through the bone, it is necessary for the sound pickup component t...

Claims

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Application Information

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IPC IPC(8): H04R19/01H04R7/04
CPCH04R7/04H04R19/016
Inventor 李忠凯曹方豹
Owner GOERTEK MICROELECTRONICS CO LTD