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Hybrid panel method of manufacturing electronic devices and electronic devices manufactured thereby

A technology for electronic devices and sub-panels, which is applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., and can solve the problems of large package size, insufficient packaging, and reduced reliability.

Pending Publication Date: 2021-08-24
AMKOR TECH SINGAPORE HLDG PTE LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Current semiconductor packages and methods of forming semiconductor packages are inadequate, for example resulting in excessive cost, reduced reliability, or excessive package size

Method used

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  • Hybrid panel method of manufacturing electronic devices and electronic devices manufactured thereby
  • Hybrid panel method of manufacturing electronic devices and electronic devices manufactured thereby
  • Hybrid panel method of manufacturing electronic devices and electronic devices manufactured thereby

Examples

Experimental program
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Embodiment Construction

[0035] The following discussion presents various aspects of the disclosure by providing examples of the disclosure. Such examples are non-limiting, and thus the scope of various aspects of the present disclosure is not necessarily limited by any particular feature of the examples provided. In the discussion that follows, the phrases "for example," "such as," and "example" are non-limiting, and are generally synonymous with "by way of example and not limitation," "such as and not limitation," and the like.

[0036] As used herein, "and / or" refers to any one or more of the items in the list connected by "and / or". As an example, "x and / or y" refers to any element of the three-element set {(x), (y), (x, y)}. In other words, "x and / or y" means "either or both of x and y". As another example, "x, y, and / or z" refers to the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y, z)} any element. In other words, "x, y, and / or z" means "one or more of x, y, and z." Simila...

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PUM

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Abstract

A hybrid panel method of (and apparatus for) manufacturing electronic devices, and electronic devices manufactured thereby. As non-limiting examples, various aspects of this disclosure provide an apparatus for manufacturing an electronic device, where the apparatus is operable to, at least, receive a panel to which a subpanel is coupled, cut around a subpanel through a layer of material, and remove such subpanel from the panel. The apparatus may also, for example, be operable to couple to an upper side of the subpanel, and remove the subpanel from the panel by, at least in part, operating to rotate the subpanel relative to the panel.

Description

technical field [0001] The present disclosure generally relates to a hybrid panel method (and apparatus) for manufacturing electronic devices, and electronic devices manufactured thereby. Background technique [0002] Current semiconductor packages and methods of forming semiconductor packages are inadequate, eg resulting in prohibitive cost, reduced reliability, or excessive package size. Further limitations and disadvantages of these methods will become apparent to those skilled in the art by comparing conventional and conventional methods with the present disclosure set forth in the remainder of this application with reference to the accompanying figures. Contents of the invention [0003] Aspects of the present disclosure provide hybrid panel methods (and apparatuses) for manufacturing electronic devices, and electronic devices manufactured thereby. As a non-limiting example, various aspects of the present disclosure provide a method of manufacturing an electronic dev...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50H01L21/56H01L21/683H01L21/67
CPCH01L21/50H01L21/561H01L21/568H01L21/6835H01L21/67121H01L2221/6835H01L2221/68381H01L2924/1815H01L2224/73267H01L2224/04105H01L2224/96
Inventor 波拉·巴洛格鲁苏雷什·贾亚拉曼拉诺德·胡莫勒安德烈·卡多索伊昂·欧多乐
Owner AMKOR TECH SINGAPORE HLDG PTE LTD