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A method of manufacturing a conductive pattern

A patterned, conductive silver technology, applied in the post-processing of printing, ink, printing, etc., can solve the problems of the influence of the final silver layer conductivity, the insufficient jetting stability of silver inkjet ink, inkjet printing, etc.

Inactive Publication Date: 2021-11-30
AGFA GEVAERT AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, the jetting stability of silver inkjet inks according to EP-A 3037161 is generally not sufficient for reliable, long-term inkjet printing
[0013] To provide improved jetting stability, higher amounts of stabilizer may be required, however this may negatively affect the conductivity of the final silver layer

Method used

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  • A method of manufacturing a conductive pattern
  • A method of manufacturing a conductive pattern
  • A method of manufacturing a conductive pattern

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0162] Preparation of silver ink

[0163] The preparation of silver inks typically involves adding Compound A and other ingredients to the silver particles by using homogenization techniques such as stirring, high shear mixing, sonication, or a combination thereof.

[0164] The silver particles are typically a paste or highly concentrated dispersion of silver nanoparticles from which the silver ink is prepared.

[0165] A preferred method of preparation of silver nanoparticles is disclosed in EP-A 2671927.

[0166] The homogenization step can be carried out at elevated temperatures up to 100°C. In a preferred embodiment, the homogenization step is carried out at a temperature equal to or lower than 60°C.

[0167] It has been observed that for silver inkjet inks, sonication prior to loading the inkjet into the printhead improves jetting performance and ink stability, ie reliability and higher jetting frequency.

[0168] Inkjet printing device

[0169] Various embodiment...

Embodiment 1

[0224] Preparation of Silver Nanoparticle Dispersion NPD-01

[0225] 20.0 grams of silver oxide (from Umicore) was added to a mixture of 40.0 grams of ethanol and 23.0 grams of 2-pyrrolidone with stirring. The pre-dispersion was then stirred for 24 hours.

[0226] Then, 2.67 ml of formic acid (1.25 ml / min) were added to the predispersion with stirring and keeping the temperature at room temperature. After the addition of formic acid, the mixture was further stirred at 23-25°C for 2.5 hours.

[0227] The mixture was then filtered through a 60 µm filter cloth. The filtrate was then concentrated at 40°C, first at 110 mbar for 60 minutes, and then at 60 mbar for 30 minutes, yielding a silver nanoparticle dispersion containing ±45 wt% silver.

[0228] Preparation of silver ink

[0229] Silver inks were prepared by mixing 50 wt % of NPD-01 with 25 wt % of 2-phenoxy-ethanol and 25 wt % of gamma-butyrolactone and an amount of Compound A as specified in the Examples. The amount of...

Embodiment 2

[0231] As described above, silver inkjet inks SI-01 to SI-07 were prepared using compound A-17 that decomposed exothermically and comparative compound A-C01 that decomposed endothermically. The amounts of these two compounds are indicated in Table 4.

[0232] Table 4

[0233] silver ink Compound A [A] Sheet Resistance (Ω / square) Ag content (g / m 2 )

Bulk Conductivity (%) SI-01 - 0.223 4.7 15.9 SI-02 A-17 0.1 0.232 4.73 15.2 SI-03 A-17 0.2 0.214 3.80 20.5 SI-04 A-17 0.3 0.163 2.68 38.2 SI-05 A-C01 0.1 0.187 5.18 17.2 SI-06 A-C01 0.2 0.242 4.11 16.7 SI-07 A-C01 0.3 0.141 6.61 17.9

[0234] Silver inkjet inks SI-01 to SI-07 were coated on Powercoat HD substrates at a wet coating thickness of 10 µm. The coated samples were then placed in a belt system that was operated under a NIR lamp (NIR ADPHOS lamp, 1 bulb, 5.4 kW lamp power). All samples were passed under the lamp at a stage ...

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Abstract

A method of preparing a conductive silver pattern on a substrate comprising the step of: - applying a silver ink on the substrate to form a silver pattern, and - sintering the applied silver pattern, characterized in that the silver ink comprises a compound A which decomposes exothermally during sintering.

Description

[0001] Field of Invention [0002] The present invention relates to methods for preparing conductive patterns on various substrates. [0003] Background of the Invention [0004] Interest in metal printing or coating fluids containing metal nanoparticles has increased over the past few decades due to their unique properties when compared to the bulk properties of a given metal. For example, the melting point of metal nanoparticles decreases with decreasing particle size, making them of interest for printed electronics, electrochemistry, optics, magnetism, and biology applications. [0005] It is of great interest to produce stable and concentrated metal printing or coating fluids, which can be printed, for example, by inkjet printing, or coated at high speed, since it enables the production of electronic devices at low cost . [0006] Metal printing or coating fluids are typically metal nanoparticle dispersions comprising metal nanoparticles and a dispersion medium. Such met...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/38C09D11/52
CPCC09D11/52C09D11/38C09D11/101C09D11/03B41M7/0072B41M7/009C09D11/037C09D11/322
Inventor F·科尔特斯萨拉查K·范登博舍
Owner AGFA GEVAERT AG