Solvent-based conductive ink, preparation method and application

A solvent-based and ink-based technology, applied in the field of additive manufacturing, can solve problems such as long processing time, high post-processing temperature, and easy plugging, and achieve the effects of simple preparation method, low post-processing temperature and low cost

Inactive Publication Date: 2019-03-01
SHANGHAI MI FANG ELECTRONICS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The purpose of the present invention is to overcome the above-mentioned defects such as easy agglomeration of the ink, poor stability, easy plugging during inkjet printing, high post-processing temperature, and long processing time, and

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Dissolve 1g of silver oxalate in 2.5mL of ammonia water, 10mL of ethanol and 1mL of ethylene glycol, then add 0.2mL of formic acid, stir at room temperature for 10min, then let stand overnight, filter to obtain a clear solution, then add 0.5% polyvinyl alcohol to obtain a conductive The ink has a viscosity of 5.62mPa·s at room temperature. Use a 3D printer to print the conductive ink on a flexible PET substrate, then heat it at 130°C for 2 minutes, and the square resistance is 1.2Ω / □.

Embodiment 2

[0033] Dissolve 0.5g of silver acetate in 0.5mL of ethylamine and 0.5mL of isooctylamine, and stir at room temperature until the solid is completely dissolved. Then, 0.8 mL of methyldiethanolamine and 1 mL of 0.5% hydroxyethylcellulose in methanol were added. Stand overnight to obtain a clear conductive ink with a viscosity of 4.76mPa·s at room temperature. Use a 3D printer to print the conductive ink on a flexible PET substrate, then heat it at 150°C for 2min, and the square resistance is 0.8Ω / □.

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Abstract

The invention relates to a solvent-based conductive silver ink, a preparation method and an application. The solvent-based metal conductive ink for ink jet printing is characterized by being preparedfrom 10%-30% metal salt, 1%-10% of a reducing agent, 10%-30% of a complex stabilizer, 40%-60% of a solvent and 0.1%-0.5% of an additive, wherein the sum of mass percentage of the components is 100%. The preparation method comprises the following steps: firstly, dissolving the metal salt in a stabilizer and a solvent, then adding the reducing agent, performing stirring at room temperature, then leaving the mixture to stand overnight, performing filtering to obtain a clear solution, and then adding the additive to obtain the conductive ink. A complex precursor solution is formed with the preparation method of the ink, the conductive ink is printed on a flexible substrate by a 3D ink jet printer in an additive manufacturing mode, and a conductive film is obtained by heating. The preparation method is simple, low in cost and low in post-treatment temperature. The prepared solvent-based conductive ink is suitable for ink jet printing and spray holes are prevented from being blocked; the conductive ink is suitable for preparing electrode circuits of various flexible electronic devices such as solar cells, field effect transistors, RFID and the like.

Description

technical field [0001] The invention belongs to the field of additive manufacturing, and in particular relates to a conductive ink, in particular to a solvent-based conductive ink, a preparation method and an application. Background technique [0002] Flexible electronics has become a major trend in the future of the industry due to its features such as bendability, stretchability, ultra-thin, ultra-low power consumption, durability, and portability. However, cost and mass production are important challenges for flexible electronic products to move from laboratory to large-scale commercial use in the future. Using inkjet printing technology can significantly reduce the cost of manufacturing flexible electronic devices, even comparable to the cost of printing newspapers. In addition, the development of microelectronics technology puts forward higher requirements for the production of printed electronic materials, and further develops in the direction of high density, thin wi...

Claims

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Application Information

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IPC IPC(8): C09D11/52C09D11/30
CPCC09D11/30C09D11/52
Inventor 王家林李胜夏
Owner SHANGHAI MI FANG ELECTRONICS LTD
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