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Lead engagement device

A technology of wire bonding and equipment, applied in medical science, surgery, cardiac electrodes, etc., can solve problems such as fracture, CIED lead deformation, etc.

Pending Publication Date: 2021-12-03
KONINKLJIJKE PHILIPS NV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these devices usually have the disadvantage that they are attached to the CIED leads in localized areas
Applying traction to the CIED lead and / or the CIED wire bonding device may cause the CIED lead to deform and / or break before it can be removed from the patient

Method used

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  • Lead engagement device
  • Lead engagement device
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Examples

Experimental program
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Embodiment Construction

[0037]Before any embodiments of the present disclosure are explained in detail, it is to be understood that the disclosure is not limited in application to the details of construction and the arrangement of parts set forth in the following description or shown in the following drawings. The disclosure is capable of other embodiments and of being practiced or carried out in various ways. Also, it is to be understood that the phraseology and terminology used herein are for the purpose of description and should not be regarded as limiting. Use of "including," "comprising" or "having" and variations thereof herein is intended to cover the items listed thereafter and their equivalents, as well as additional items.

[0038] The present disclosure generally relates to wire bonding devices for bonding implanted leads, such as cardiac implantable electronic device ("CIED") leads, and facilitating removal of the implanted leads from a patient's body. refer to figure 1 , which illustra...

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PUM

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Abstract

A lead engagement device is configured to be positioned in a lead lumen. The lead engagement device includes a hypotube. The hypotube includes a wall having an inner surface defining an inner lumen and an outer surface. The wall defines a longitudinal axis of the hypotube. A plurality of lead engagement fingers extend outwardly and proximally from the outer surface at acute angles, and planes in which the acute angles are disposed extend diagonally relative to the longitudinal axis. The plurality of lead engagement fingers are configured to translate relative to the lead and permit relative motion between the lead engagement device and the lead when applying a first force to the lead engagement device. The plurality of lead engagement fingers are configured to engage the lead and inhibit relative motion between the lead engagement device and the lead when applying an opposite second force to the lead engagement device.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of U.S. Provisional Application Serial No. 62 / 840,308, filed April 29, 2019, which is incorporated herein by reference. technical field [0003] The apparatus described herein relates generally to wire bonding apparatus for engaging and facilitating removal of implanted leads, such as cardiac implantable electronic device ("CIED") leads, from a patient's body, and more particularly to wire bonding apparatus for bonding implanted leads ("CIED"). Wires provide a relatively large area for wire bonding equipment. Background technique [0004] Various medical procedures attach wire-like devices to internal parts of a patient's body, such as electrical leads for a cardiac implantable electronic device ("CIED"). CIED leads are conductive wires that run to electrodes that are attached to the inner wall of the patient's heart. CIED leads are typically coils of wire encased in an outer cylin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61N1/05A61B17/22
CPCA61N1/056A61B2017/22034A61N1/057A61N2001/0578A61N2001/058
Inventor W·A·鲍J·佩恩
Owner KONINKLJIJKE PHILIPS NV