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Glue residue removing device for circuit board processing

A circuit board and slag technology, applied in printed circuits, printed circuit manufacturing, printed circuit liquid treatment, etc., can solve the problems of long slag removal time, low slag removal efficiency, etc., to increase the effect and increase the slag removal efficiency. Effect

Active Publication Date: 2021-12-07
FOREWIN FPC SUZHOU
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a desmearing device for circuit board processing, which aims to solve the problems of long desmearing time and low desmearing efficiency in the existing desmearing device for circuit board processing

Method used

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  • Glue residue removing device for circuit board processing
  • Glue residue removing device for circuit board processing
  • Glue residue removing device for circuit board processing

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Embodiment Construction

[0029] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0030] The specific implementation of the present invention will be described in detail below in conjunction with specific embodiments.

[0031] like Figure 1~6 As shown, a kind of desmearing device for circuit board processing provided by the present invention includes a shell 1, and also includes:

[0032] The driving mechanism 38 is arranged in the casing 1, and the driving mechanism 38 includes:

[0033] A power assembly 27 for driving the circuit board to perform circular motion synchronously around the center of rotation; and,

[0034] During the circular motion of the circuit board aroun...

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Abstract

The invention is applicable to the field of circuit board processing devices, and provides a glue residue removing device for circuit board processing, which comprises a shell and a driving mechanism, and the driving mechanism comprises a power assembly for driving a circuit board to synchronously perform circular motion around a rotation center, a transmission assembly is used for driving the circuit board to swing back and forth in the process that the circuit board performs circular motion around the rotating center, and the transmission assembly is in transmission connection with the power assembly; a fixing mechanism is used for fixing the circuit board; a disintegrating slag collecting mechanism is connected with the fixing mechanism, and the disintegrating slag collecting mechanism is used for collecting insoluble substances generated in the slag removing process of the circuit board; according to the glue residue removing device for circuit board processing, the power assembly drives the circuit board to synchronously perform circular motion around the rotating center, so that the penetrating speed of a KMn04 solution from the side end face of the circuit board is increased, and the glue residue removing efficiency of the circuit board is effectively improved.

Description

technical field [0001] The invention belongs to the field of circuit board processing devices, and in particular relates to a desmearing device for circuit board processing. Background technique [0002] Desmear removal is the main production process in the circuit board production process, which is mainly under high temperature alkaline conditions, using KMn0 4 The strong oxidizing property will oxidize and decompose the resin carbon chain on the surface of the hole wall on the circuit board, remove the bulky and softened resin and slag, expose the hole wall and form a honeycomb-like rough structure, and improve the relationship between the hole wall and chemical copper. inter-cohesion. [0003] The existing desmearing device for circuit board processing achieves the purpose of removing slag from the hole wall of the circuit board by placing the circuit board in a potassium permanganate solution and performing a natural reaction under high temperature conditions. The smea...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0085H05K3/0088
Inventor 皇甫铭陈林伟
Owner FOREWIN FPC SUZHOU
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