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Semiconductor packaging equipment

A technology for packaging equipment and semiconductors, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of poor packaging effect and low efficiency, improve practicability and work efficiency, avoid excessive temperature, improve The effect of work efficiency

Pending Publication Date: 2022-01-07
容泰半导体(江苏)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the existing semiconductor packaging equipment has low efficiency and poor packaging effect

Method used

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  • Semiconductor packaging equipment
  • Semiconductor packaging equipment
  • Semiconductor packaging equipment

Examples

Experimental program
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Embodiment Construction

[0027] The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0028] like Figure 1-Figure 7 As shown, a semiconductor packaging equipment includes a box body 1, the four corners of the bottom of the box body 1 are fixedly connected with support columns 2, and the surface of the box body 1 is provided with a box door 3, and the middle position of the bottom of the box body 1 is fixed. The bearing 4 is connected, and the bottom of the box body 1 is fixedly connected with the installation plate 5, and the inside of the installation plate 5 is fixedly connected with the first servo motor 6, and the extension shaft of the first servo motor 6 is fixedly connected with the bearing 4 , the inside of the bearing 4 is fixedly connected...

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Abstract

The invention relates to semiconductor packaging equipment. The equipment comprises a box body, supporting columns are fixedly connected to the four corners of the bottom of the box body, a box door is arranged on the surface of the box body, a bearing is fixedly connected to the middle of the bottom of the box body, and a mounting plate is fixedly connected to the bottom of the box body. The equipment is simple in structure and convenient to use; through mutual cooperation of a first servo motor, a workbench, a push block, an air cylinder, a first electric push rod and a glue storage barrel, automatic feeding and discharging and glue dispensing treatment can be conducted on a semiconductor, and a full-automatic machining mode is adopted, the machining efficiency and quality are improved; a semiconductor needing to be packaged is placed into a connecting bin through a groove in the left side surface of the box body, the air cylinder is started, the air cylinder pushes the push block to reciprocate in the connecting bin, the semiconductor needing to be packaged is pushed into a concentric-square-shaped block, so that dispensing is convenient; and after dispensing is completed, a second electric push rod pushes a limiting block, the packaged semiconductor is pushed out, and a user can conveniently take the packaged semiconductor.

Description

technical field [0001] The invention and a semiconductor packaging device belong to the technical field of mechanical numerical control machine tools. Background technique [0002] A conductor is a substance whose conductivity is between an insulator and a conductor. Its conductivity is easy to control and can be used as a component material for information processing. From the perspective of technology or economic development, semiconductors are very important. The core unit of many electronic products, such as computers, mobile phones, and digital tape recorders, utilizes changes in the conductivity of semiconductors to process information. Common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is the most influential one in commercial applications among various semiconductor materials. [0003] During the use of semiconductor devices, in order to prevent the short circuit of semiconductor devices caused by falling dust, a protecti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67126
Inventor 程天映
Owner 容泰半导体(江苏)有限公司
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