Sheet like variable resistor having metallic terminals

Abstract

This invention relates to a chip-type variable-resistor, is provided with insulation substrate 1; the resistor 2, which is set on the upper surface 1a of this insulation substrate; the electrode 3, which is connected to both ends of the resistor and is installed on top of the insulation substrate; the first terminal 5 with a bottom plate 5a, which is formed by metal plate and is installed on the insulation substrate; the concave portion 1g with at least two opened side face 1c directions, which is installed under the insulation substrate 1b. The bottom plate of the first terminal is disposed inside the concave portion of the insulation substrate. At the same time, there is a gap formed below the insulation substrate and below the bottom plate.

Description

technical field [0001] The present invention relates to chip variable resistors, in particular to the terminal structure of semi-fixed chip variable resistors. Background technique [0002] In the prior art, the terminal structure of the chip varistor is a terminal composed of a metal plate mounted on a plate-shaped ceramic insulating substrate. At this time, the terminal mounted on the insulating substrate is placed on the flat bottom surface of the insulating substrate. It is installed in the state protruding from the flat bottom surface. [0003] Next, the structure of another chip varistor in the prior art will be described with reference to the accompanying drawings. Figure 15 It is a perspective view showing this conventional chip varistor. Figure 16 It is a cross-sectional view showing a state where this conventional chip varistor is mounted on a printed circuit board. [0004] Such as Figure 15 , Figure 16 As shown, the insulating substrate 30 is made of a cer...

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Problems solved by technology

[0024] However, in the former conventional chip varistor, since the insulating substrate is made of ceramics, when a thick substrate is used, the terminals protrude from the bottom surface of the insulating substrate, which not only hinders thinning, but also causes problems during installation. , since the protrusion amount of the protruding terminal is large, the mounting state of the chip varistor on the printed circuit board is unstable

[0025] In addition, in the latter conventional chip varistor, since the second electrode 32 and the third electrode 33 formed on the lower surface 30b of the insulating substrate 30 are directly in contact with the printed circuit board 20 and soldered, the soldering When the solvent contained in the solder paste volatilizes (vaporizes), the soldering of the contact surface between the second and third electrodes 32, 33 and the printed circuit board 20 is not easy to volatilize because it is shielded from the upper and lower surfaces. This part is in a state where the solvent does not volatilize. When the solvent remains, the contact and connection reliability of this part cannot be ensured, which may cause poor conduction.

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