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Warping degree measuring device

A technology for measuring devices and warpage, which is applied in the direction of measuring devices, mechanical measuring devices, and mechanical devices, etc., can solve problems such as unsuitable for daily use in laboratories, inability to accurately measure warpage values, and electrostatic breakdown of power modules. Achieve the effect of simple measurement, stable measurement and low cost

Pending Publication Date: 2022-04-19
SHENZHEN BASIC SEMICON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A laser positioning device for warpage measurement, but this device is expensive and not suitable for daily use in the laboratory
Another method is to measure with a calibrated marble, and place the DBC on a flat marble to detect the flatness, but this method cannot accurately measure the warpage value of each

Method used

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  • Warping degree measuring device
  • Warping degree measuring device
  • Warping degree measuring device

Examples

Experimental program
Comparison scheme
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Example

[0045] First embodiment

[0046] The present embodiment provides a warpage measurement device 100. Please refer to Figure 1 , the warpage measuring device 100 includes a base 10, a bearing mechanism 20 and a measuring mechanism 30. The bearing mechanism 20 includes a first bracket 21 and a measuring platform 22. The measurement platform 22 is formed on the first through hole 221. The two ends of the first bracket 21 are respectively connected to the measuring platform 22 and the base 10 threaded, and between the measuring platform 22 and the base 10 to form an installation area 211. The measuring mechanism 30 includes a measuring unit 31 and a probe 32 protruding from the measuring unit, the measuring unit 31 is mounted within the mounting area 211, and the first end of the probe 32 protrudes the first through hole 221.

[0047] In the present embodiment, the thread connection depth between the first bracket 21 and the measuring platform 22 and the base 10 may be adjusted, the heig...

Example

[0053] Second embodiment

[0054] Please refer to Figure 4 , the present embodiment differs from the first embodiment in that the second bracket 40 includes a support portion 43 and an anti-support portion 44 that is fixedly connected to the support portion 43. The support portion 43 is fixed to the base 10. The holding part 44 is provided with a second through hole 441. The anti-holding portion 44 is used to place the measurement portion 31, and so that the second end of the probe 32 may freely protrude the second through hole 441.

[0055] In the present embodiment, the shape of the resistance portion 44 corresponds to the outer contour portion of the measurement portion 31, so that the resistance portion 44 is in full contact with the measurement portion 31.

[0056] The warpage measuring device 100 by providing a base 10 and a bearing mechanism 20 to provide a warpage measurement platform; and by providing a second bracket 40, to fix the measuring mechanism 30 inverted. In thi...

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Abstract

The invention discloses a warping degree measuring device. The warping degree measuring device comprises a base, a bearing mechanism and a measuring mechanism. The bearing mechanism comprises a first support and a measuring platform. A first through hole is formed in the measuring platform. The two ends of the first support are in threaded connection with the measuring platform and the base respectively, and an installation area is formed between the measuring platform and the base. The measuring mechanism comprises a measuring part and a probe extending out of the measuring part, the measuring part is erected in the mounting area, and the first end of the probe extends out of the first through hole. Thus, the to-be-measured module does not need to be inverted, and the purposes of low cost and simple measurement can be achieved. The method is stable in measurement, low in cost and simple to operate.

Description

technical field [0001] The invention relates to a warpage measuring device. Background technique [0002] Warpage refers to the amount of warping deformation produced by the product relative to the design size and shape. In the field of semiconductor power module packaging technology, the module DBC will be deformed due to the influence of packaging processes such as welding and bonding, and the deformation and warping of the DBC will have a great impact on the reliability of subsequent modules. Therefore, it is necessary to detect the warpage of the DBC after the power module is packaged. [0003] There are two methods for detecting warpage in existing packaging factories. A laser positioning device is used for warpage measurement, but this device is expensive and not suitable for daily use in the laboratory. Another method is to measure with a calibrated marble, and place the DBC on a flat marble to detect the flatness, but this method cannot accurately measure the warp...

Claims

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Application Information

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IPC IPC(8): G01B5/30
CPCG01B5/30G01B5/0004
Inventor 杨柳孙军张振中和巍巍
Owner SHENZHEN BASIC SEMICON LTD