Dielectric filter and electronic equipment

Abstract

The embodiment of the invention provides a dielectric filter and electronic equipment. The dielectric filter includes a filtering portion made of a high dielectric material and having a plurality of coupling holes disposed at predetermined positions of an interface surface and a ground port; each input and output pin comprises a coupling part and an interface part, the coupling parts are in press fit with the corresponding coupling holes in an interference fit mode, and the grounding ports and the interface parts are coupled to a circuit board of the electronic equipment through solder. The input and output pins are in press fit with the coupling holes in an interference fit manner, so that a carrier plate does not need to be used for indirectly assembling the filtering part on the circuit board of the electronic equipment, the miniaturization and the light weight of the electronic equipment are effectively promoted, and the cost can be further reduced.

Description

technical field [0001] Embodiments of the present application generally relate to the field of filters. More specifically, the embodiments of the present application relate to a dielectric filter and electronic equipment including the dielectric filter. Background technique [0002] A filter is a frequency-selective device that allows specific frequency components in a signal to pass while greatly attenuating other frequency components. Utilizing this frequency selection function of the filter, it is possible to filter out interference noise or perform spectrum analysis. There are many types of filters, and different types of filters have different frequency ranges and occasions. Dielectric filters are formed by coupling between dielectric resonators. Dielectric resonator filters have high Q value, low insertion loss, small size and light weight, and are widely used in wireless base stations, satellite communications, navigation systems, electronic countermeasures and oth...

AI Technical Summary

Problems solved by technology

The existing dielectric filter board-level connection technology uses the welding method with a carrier board to realize the connection of electrical performance. However, due to the large thermal expansion coefficient mismatch between the ceramic dielectric and the circuit board during the application process, the board-level application of the filter Reliability problems are becoming more and more prominent, the main problem is the temperature cycle cracking of the solder joints between the pins of the dielectric filter and the ceramic dielectric, and the ceramic dielectric and the carrier board

In addition, the cost of circuit board and surface mount technology accounts for as high as 25%, and the product line has a strong demand for cost reduction

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