Diamond wire and preparation method thereof

A diamond wire and busbar technology, applied in the field of diamond wire and its preparation, can solve problems such as weakening of the cutting force of the diamond wire

Pending Publication Date: 2022-05-27
LONGI GREEN ENERGY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, as the diameter of the diamond wire becomes smaller, the

Method used

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  • Diamond wire and preparation method thereof
  • Diamond wire and preparation method thereof
  • Diamond wire and preparation method thereof

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[0031] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

[0032] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0033] In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated tech...

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Abstract

The invention discloses a diamond wire and a preparation method thereof, relates to the technical field of silicon wafer cutting, and is used for guaranteeing the cutting force of the diamond wire under the condition that the diameter of the diamond wire is reduced. The diamond wire comprises a bus, a conductive part arranged on the periphery of the bus and an electroplated layer at least formed on the bus. And a preset included angle is formed between the projection of the conductive part on the bus and the extension direction of the bus. And the conductive part is used for enhancing the conductivity of the bus in the process of forming the electroplated layer. The preparation method of the diamond wire comprises the following steps that the conductive part is arranged on the periphery of the bus; and electroplating the bus to obtain the diamond wire.

Description

technical field [0001] The invention relates to the technical field of silicon wafer cutting, in particular to a diamond wire and a preparation method thereof. Background technique [0002] Electroplated diamond wire is a wire cutting tool used for hard and brittle materials such as silicon wafer cutting by consolidating the diamond abrasive on the busbar in a certain way. [0003] With the development of the photovoltaic industry, technological transformation and cost reduction and green production have become part of the vitality of the enterprise. At present, the method of gradually reducing the diameter of the diamond wire is mostly adopted to reduce the silicon loss generated when the diamond wire cuts the silicon rod. However, as the diameter of the diamond wire becomes smaller, the cutting force of the diamond wire itself will be greatly weakened. Therefore, it is worth studying how to ensure the cutting force of the diamond wire when the diameter of the diamond wir...

Claims

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Application Information

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IPC IPC(8): C25D7/06C25D21/12
CPCC25D7/0607C25D21/12Y02E10/50
Inventor 张济蕾成路郭瑞波吕海亮
Owner LONGI GREEN ENERGY TECH CO LTD
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