Method for producing electronic component

Abstract

Embodiments of the present disclosure relate to a method for manufacturing an electronic component wherein the method comprises the steps of: providing a substrate and a functional layer supported by the substrate; forming a structured protective layer on one side of the substrate, the functional layer being attached to one side of the substrate, where the structured protective layer has a recess such that a portion of the functional layer is exposed; applying a dispersion comprising a solvent and a conductive component to the exposed portion of the functional layer such that the recess is at least partially filled with the dispersion; drying the dispersion to create a conductive layer; and removing the structured protection layer.

Description

technical field [0001] Embodiments relate to a method for manufacturing an electronic component. More specifically, embodiments relate to a method for manufacturing an electronic component, wherein a dispersion is applied to a functional layer and dried to create a conductive layer. Background technique [0002] Obtaining a conductive layer with a defined pattern by applying and drying the dispersion is a challenge when using selective deposition techniques such as inkjet printing. In particular, the accumulation of material on the edges of the pattern of the conductive layer due to the Marangoni effect results in conductive paths surrounding the desired pattern of the conductive layer. This results in poor yields in subsequent devices such as chemi-resistive gas sensors. [0003] Therefore, there is a need for an improved method for manufacturing electronic components. SUMMARY OF THE INVENTION [0004] This problem is solved by a method for manufacturing electronic com...

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Problems solved by technology

This leads to poor yields in subsequent d

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