Printed circuit board production line
A printed circuit board and production line technology, which is applied in the direction of printed circuit, printed circuit manufacturing, multilayer circuit manufacturing, etc., can solve the problems of low production efficiency of printed circuit boards
Pending Publication Date: 2022-06-21
ZHUHAI FOUNDER TECH MULTILAYER PCB +2
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Problems solved by technology
[0004] The embodiment of the present disclosure provides a printed circuit board production line to solve the technical problem of low production efficiency of printed circuit boards in the related art
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[0048] Multilayer circuit boards have been widely used in various electronic devices because of their advantages of higher wiring density and smaller volume. In the related art, during production, holes are generally punched on each inner-layer core board by punching equipment, and then the inner-layer core boards are stacked together, and then pressed together to form a multi-layer circuit board.
[0049] However, the circuit images on each inner-layer core board may be different, so the inner-layer core boards are generally stacked together in a specific order by manual means, resulting in lower production efficiency of multi-layer circuit boards.
[0050]In view of this, an embodiment of the present disclosure provides a printed circuit board production line, by sequentially arranging a matching device, a punching device, a stacking device and a pressing device along the production direction, and the matching device includes a storage device and a transfer device. The equip...
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The embodiment of the invention relates to the technical field of circuit boards, in particular to a printed circuit board production line, which is used for solving the technical problem of low production efficiency of printed circuit boards in related technologies, and comprises a matching device, a punching device, a stacking device and a pressing device which are sequentially arranged along the production direction, the equipment comprises storage equipment and transfer equipment, the storage equipment comprises a plurality of storage spaces which are sequentially arranged at intervals in the vertical direction, and each storage space is used for storing one type of inner-layer core boards; the transfer equipment is used for conveying the inner-layer core plates in the storage spaces to the punching equipment according to a preset sequence; the punching equipment is used for punching the inner-layer core plates in sequence; the stacking equipment is used for sequentially stacking the inner-layer core boards output by the punching equipment together, and the pressing equipment is used for pressing the inner-layer core boards stacked by the stacking equipment together, so that the inner-layer core boards do not need to be sorted manually, and the technical problem of low production efficiency of printed circuit boards in related technologies is effectively solved.
Description
technical field [0001] The embodiments of the present disclosure belong to the technical field of circuit boards, and in particular, relate to a printed circuit board production line. Background technique [0002] Multilayer circuit boards have been widely used in various electronic devices because of their advantages of higher wiring density and smaller volume. In the related art, during production, holes are generally punched on each inner-layer core board by punching equipment, and then the inner-layer core boards are stacked together, and then pressed together to form a multi-layer circuit board. [0003] However, the circuit images on each inner-layer core board may be different, so the inner-layer core boards are generally stacked together in a specific order by manual means, resulting in lower production efficiency of multi-layer circuit boards. SUMMARY OF THE INVENTION [0004] Embodiments of the present disclosure provide a printed circuit board production line t...
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Login to View More IPC IPC(8): H05K3/46
CPCH05K3/4611
Inventor 叶依林向铖陈苑明
Owner ZHUHAI FOUNDER TECH MULTILAYER PCB