Electronic glass with high liquidus viscosity and preparation method

Abstract

The invention discloses electronic glass with high liquidus viscosity and a preparation method of the electronic glass. The electronic glass comprises the following raw materials in percentage by weight: 65.56-68.6% of SiO2; the content of Al2O3 is 10.58 to 14 percent; 7 to 11 percent of B2O3; 0.27% to 3.26% of SrO; 7.20% to 10.12% of BaO (BaO); 0.22%-1.22% of CaO (calcium oxide); 0 to 1.05 percent of MgO; less than 13% of MgO + CaO + SrO + BaO; the liquidus viscosity of the electronic glass is greater than 200,000 poise. The minimum value obtained by subtracting the temperature corresponding to 100,000 poise from the liquidus temperature of the electronic glass is 22 DEG C. The strain point temperature of the electronic glass is 670-739 DEG C, the Young modulus of the electronic glass is 70-83 MPa, the density of the electronic glass is 2.38-2.45 g/cm < 3 >, the liquidus viscosity of the electronic glass is ensured to be higher than 200,000 poise, overflow pull-down forming is facilitated, and a small density value can be obtained.

Description

technical field [0001] The invention belongs to the field of photoelectric display, in particular to an electronic glass with high liquidus viscosity and a preparation method. Background technique [0002] With the continuous development of display technology, people are increasingly pursuing high-resolution and high-quality images, and there are higher requirements for the size and response time of TFTs. LTPS technology has high electron mobility (1,000 times higher than amorphous silicon technology), and allows the manufacture of driver ICs and other electronic devices on glass substrates, reducing device costs, simplifying later module processes, and improving quality. It has become the mainstream TFT manufacturing technology at present. [0003] The LTPS process generally uses laser annealing to crystallize the amorphous silicon layer. The most efficient polysilicon (p-Si) processing method operates at temperatures above 600°C. This method can form large areas with extr...

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Problems solved by technology

[0006] However, although the strain point and Young's modulus of the glass are improved in the prior art, the liquidus viscosity of the glass is relatively small, and the difference between the corresponding temperature and the temperature corresponding to 100,000 poises of molding becomes smaller, resulting in a margin in the molding process. The degree of crystallization is very small, and crystallization occurs during the forming process of the glass, which leads to the breakage of the glass plate during the production drawing process, which affects the production stability. Therefore, it is necessary to increase the liquidus viscosity of the glass to at least 200,000 poise, and the liquidus The minimum temperature corresponding to the phase line temperature minus 100,000 poise is 22°C, that is, △T≥22°C

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