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Homogenizing device

A technology for holding devices, wafers, used in transportation and packaging, sustainable manufacturing/processing, climate sustainability, etc., which can solve problems such as difficult to achieve

Pending Publication Date: 2022-07-12
法国塞姆科智能科技公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This uniform distribution can be difficult to achieve, especially for the wafer closest to the area where the reactant gas is introduced, especially when the pressure in the enclosure is below atmospheric pressure

Method used

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Examples

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Embodiment Construction

[0028] Like features have been designated by like reference numerals in the various figures. In particular, structural and / or functional features common to the various embodiments may have the same reference numerals and may be provided with the same structural, dimensional and material properties. For the sake of clarity, only steps and elements that are helpful in understanding the embodiments described herein have been illustrated and described in detail. In particular, silicon wafer processing methods are well known and not described in detail.

[0029] In the following description, unless otherwise specified, when referring to terms defining absolute positions (such as the terms "front", "rear", "upper", "lower", "left", "right", etc.), or defining Terms of relative position (such as the terms "above," "below," "upper," "lower," etc., or referring to terms that define orientation (such as the terms "horizontal," "vertical," etc.), mean Silicon wafer processing equipment...

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Abstract

The invention relates to a device comprising a first and a second plate (12, 14) and a device (30) for holding the plates face to face, the first plate (12) comprising at least ten through openings (24) and the second plate being not penetrated by the openings.

Description

[0001] This patent application claims priority from French patent application 19 / 10383, which is to be considered an integral part of this specification. technical field [0002] The present disclosure generally relates to a homogenization apparatus for an apparatus for processing components, particularly silicon wafers, using at least one processing gas. Background technique [0003] It is known that various silicon wafer treatments can be performed, in particular doping, diffusion and oxidation treatments. Such processing typically involves introducing the wafer into a furnace, maintaining the wafer at the processing temperature, and introducing into the furnace at least one reactive gas, possibly mixed with a carrier gas. The pressure in the furnace may be atmospheric pressure or lower than atmospheric pressure. [0004] The horizontal or vertical furnaces used generally have a tubular casing inside which silicon wafers are arranged on supports. One of the ends of the h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67754H01L21/67109
Inventor 珍-查尔斯·洛雷茨蒂希·迪伊·纽伦
Owner 法国塞姆科智能科技公司
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