Omnibearing correction module

Abstract

An omnibearing correction module comprises a transmission unit which is provided with a mounting plane and has a degree of freedom of moving in space; the suction nozzle unit is provided with an adsorption end and a mounting end which is oppositely arranged, the adsorption end can adsorb a chip or other articles to be adsorbed, and the mounting end is detachably mounted on the mounting plane of the transmission unit; the adjusting unit is provided with an adjusting end corresponding to the shape of the suction nozzle unit and a control element, and the adjusting end enables the suction nozzle unit to move and rotate on the mounting plane; and the visual identification unit is electrically connected with the control element of the adjusting unit. After the visual identification unit is used for identifying the difference between the chip and the position required by the system, the adjusting unit is used for moving the suction nozzle unit for alignment, and compared with an existing device and method, the chip straightening device has the effect of quickly and safely straightening the chip.

Description

technical field [0001] The invention relates to a chip moving device, in particular to an omnidirectional correction module that can quickly and safely straighten the chip. Background technique [0002] Chips have become an indispensable part of life in the modern age with advanced technology, but chips must undergo many moves between devices during processing, so there are many devices that move chips. However, in the existing method, when the chip is moved and placed in the tray or for subsequent operations, the chip cannot be perfectly absorbed in the predetermined position and angle of the system every time, and the transmission module must be fine-tuned for the position and angle to be smooth. Let the chip align and proceed to the next process, or use an additional adjustment module to move the chip that has been sucked up, or the transmission module first places the chip on an intermediate platform, and the intermediate platform first moves and rotates the angle of the...

AI Technical Summary

Problems solved by technology

However, when the existing method moves the chip and puts it into the tray or performs follow-up operations, because the chip cannot be perfectly picked up at the predetermined position and angle of the system every time, the transmission module must be fine-tuned for the position and angle to be smooth. Let the chip be placed in the next process, or use an additional adjustment module to move the chip that has been sucked up, or the transmission module to place the chip on an intermediary platform first, and the intermediary platform first moves and rotates the angle of the chip, The transmission module performs another suction to facilitate subsequent actions; but these three methods have their own disadvantages, for example: the transmission module itself is large and not suitable for fast movement, so it takes time to align; some chips are thin and brittle, It is not suitable to be clamped by the adjustment module; one more transport to the intermediary platform will result in one more risk of chip collision, and the intermediary platform is also difficult to move quickly

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