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Surface mounting element and mounting structure for surface mounting element

A technology of surface mount components and mounting boards, which is applied in the direction of assembling printed circuits, electrical components, semiconductor/solid-state device components, etc. with electrical components, and can solve problems such as ratio mismatch and deformation of multilayer components 1 and 2

Inactive Publication Date: 2004-08-25
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thus, in some cases, the ratio of the area of ​​the electrodes 7 and 8 to the area of ​​the inner conductor film formed on the inside of the multilayer elements 1 and 2 does not match, which causes deformation of the multilayer elements 1 and 2 during the manufacturing process.

Method used

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  • Surface mounting element and mounting structure for surface mounting element
  • Surface mounting element and mounting structure for surface mounting element
  • Surface mounting element and mounting structure for surface mounting element

Examples

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Embodiment Construction

[0028] Figure 1A and 1B A multilayer component 31 is shown, which is a surface mount component according to a first embodiment of the invention. Figure 1A The back surface of the multilayer component 31, ie the mounting surface 32, is shown. Figure 1B A multilayer component 31 surface mounted to a motherboard 33 is shown in cross-section. exist Figure 1B In , the internal structure of the multilayer component 31 is not shown.

[0029] Such as Figure 1A As shown, a plurality of terminal electrodes 34 are provided around the mounting surface 32 of the multilayer component 31 . The terminal electrode 34 may be provided with an extension portion that extends to a surface adjacent to the mounting surface 32 .

[0030] In addition, an insulating electrode 35 is formed at the center of the mounting surface 32 and disposed in the periphery of the mounting surface 32 so as to be insulated from the respective terminal electrodes 34 in the mounting surface 32 . exist Figure...

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PUM

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Abstract

On a mounting-surface (32) of a multilayered component (31) as a surface mounting component, an isolated electrode (35) is arranged so as to be isolated from other terminal electrodes (34) on the mounting-surface (32). For solder applied to the isolated electrode (35), the application range can be securely limited to an area within the isolated electrode (35).

Description

technical field [0001] The present invention relates to a surface mount component, in particular to a surface mount component, wherein a means is provided to improve the bonding strength of the surface mount component to the mounting board when the surface mount component is mounted on the mounting board. Background technique [0002] Surface mount components are surface mounted and soldered to a mounting board. As a surface mount component, a multilayer component having a multilayer structure is exemplified. In most multilayer components, surface mounting is performed on the mother board as the mounting board. [0003] Figure 6 and 7 Mounting surfaces 3 and 4 are shown, which are on the rear side, ie the mother board (not shown) side of the respective multilayer component 1 and 2, which is relevant to the invention. [0004] refer to Figure 6 and 7 , providing a means to increase the strength of bonding the multilayer components 1 and 2 to the motherboard when the mul...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/12H01L23/498H05K3/34
CPCH01L2924/0002H01L23/49838H05K2201/10969H05K2203/168H05K2201/09781H01L23/49805H05K2201/10727H05K3/341H05K3/3442Y10T29/4913Y10T29/49155Y02P70/50H01L2924/00
Inventor 笈田敏文落井纪宏奥田修功佐藤芳郎藤川胜彦
Owner MURATA MFG CO LTD