Adaptive probe device

A technology of probes and microelectronic devices, applied in the field of adaptable probe devices, to achieve the effect of improving production efficiency and reducing size

Inactive Publication Date: 2005-06-01
菲康姆株式会社
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0018] The methods listed above and others have been unsuccessful in providing high performance probes that enable economical hardening and rapid testing of microelectronic devices on wafers before the wafers are diced into discrete chips

Method used

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Examples

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Embodiment Construction

[0055] In accordance with the principles of the present invention, a first preferred embodiment of an adaptable probe is shown in Figure 5 . The disclosed probes allow reliable electrical connections to be made on contact pads of microelectronic devices such as integrated circuits (ICs), flip-bond chips, passive devices, and chip-scale packages. The probe provides elastic vertical movement of the probe tip 81 in response to a force on the tip. Thus, when the contact pad is urged into contact with the probe tip 81, the mechanical bending of the structure allows the tip to come into contact with the mating contact pad with a force sufficient to cause the probe tip 81 to penetrate the pad on the pad. insulating oxide film. The mechanical flexing of the probes accommodates the height variation of the contact pads in the microelectronic device area, while providing sufficient force on each probe tip to ensure a reliable electrical connection between the tip and the corresponding...

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Abstract

A mechanically conformable probe for making electrical connections to contact pads on a microelectronic device. Probes can be used for stress testing of integrated circuits at the wafer level. Add-ons include probe cards for testing integrated circuits and sockets for flip-chips. One configuration of the probe includes a probe tip 81 secured to an extension arm 82 extending laterally from an elongated flat spring 83 . Springs are supported by posts 85 above base plate 89 such that the probe tip is free to move vertically in response to contact forces on the probe tip. The deflection of the probe tip is limited by the bending and twisting of the leaf spring. The mechanical conformability of the probe tips allows the probe array to contact pads on integrated circuits where the pads are not exactly planar.

Description

[0001] Cross References to Related Applications [0002] This application utilizes the co-pending application entitled "Contacting Device". technical field [0003] The present invention relates to burn-in and inspection of microelectronic devices, and in particular to contact assemblies used to connect electrical signals to integrated circuits during burn-in and testing of individual chips and entire wafers. Background technique [0004] During production, microelectronic devices are subjected to a series of testing procedures to verify functionality and reliability. The testing process typically includes wafer probe testing, in which microelectronic device chips are tested before they are diced from the wafer and packaged to determine the operation of each chip. Probe cards made of long cantilever wires are used to test one or several chips at the wafer level. [0005] Typically, during wafer probe testing, not ...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): H01L21/66G01R31/316G01R31/26G01R1/067G01R1/073
CPCG01R1/06727G01R1/06738G01R1/07314H01L22/00
Inventor迪斯蒂法诺·托马斯·H
Owner菲康姆株式会社