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Detachable heat dissipating for internal memory module of computer

A technology of internal memory and heat dissipation device, applied in computing, digital data processing components, instruments, etc., can solve problems such as affecting execution performance and memory component failure

Inactive Publication Date: 2006-02-22
LAB PLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] During the operation of the computer, many internal electronic components and memory components will generate a lot of heat sources, especially the new memory components required by high-speed computers will generate heat sources. The continuous rise of the heat source temperature of the memory components will affect its performance. Severe cases may even cause memory components to fail, and currently there is no cooling device designed for the heat dissipation of this memory component

Method used

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  • Detachable heat dissipating for internal memory module of computer
  • Detachable heat dissipating for internal memory module of computer
  • Detachable heat dissipating for internal memory module of computer

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Embodiment Construction

[0015] Please refer to Fig. 1, the present invention provides a detachable heat dissipation device applied to computer internal memory components, which mainly includes a heat dissipation plate component 1 and a heat sink component 2, wherein the heat dissipation plate component 1 is divided into two pairs of thermally conductive materials The cooling fins 11 are assembled and coated on the memory component 3, and the two sets of cooling fins 11 are respectively provided with concave grooves 111 on the mating surfaces, which can respectively shield the chips 31 protruding from the two outer sides of the memory component 3 covered but directly against heat conduction (such as image 3 shown), or use the space between the chip 31 and the concave groove 111 to conduct heat source conduction through a heat conduction interface 4 (such as Figure 4 shown), and the thermal interface 4 can be heat dissipation paste or heat dissipation tape, and the two sets of paired heat sinks 11 are...

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Abstract

A detachable heat sink unit for the memory module of computer is composed of heat-sink plate module and heat sink module. Said heat-sink plate module consists of two groups of opposite radiating plates made of heat conducting material and covers said memory module. Said heat-sink module may be fan frame or heat conducting tubes, which are fixed on the extended part of said heat-sink plates, for heat exchanging by heat source absorbed from memory module.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a detachable heat dissipation device applied to internal memory components of a computer. Background technique [0002] During the operation of the computer, many internal electronic components and memory components will generate a lot of heat sources, especially the new memory components required by high-speed computers will generate heat sources. The continuous rise of the heat source temperature of the memory components will affect its performance. Severe cases may even cause memory components to fail, and currently there is no heat dissipation device designed for the heat dissipation of the memory components. Contents of the invention [0003] The purpose of the present invention is to provide a detachable cooling device applied to computer internal memory components, which can be assembled on the memory components without any modification before the PC motherboard, including he...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20
Inventor 薛永健
Owner LAB PLC