Backflow brazier

A technology of reflow soldering furnace and closed cavity, which is applied in the direction of welding equipment, welding equipment, manufacturing tools, etc., and can solve the problem of insufficient application of heat

Active Publication Date: 2004-07-28
SENJU METAL IND CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, heat cannot be adequately applied to the narrow portion of the PCB directly above the anti-warpage mechanism

Method used

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  • Backflow brazier
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Examples

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Comparison scheme
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Embodiment Construction

[0014] First refer to figure 1 , shows a reflow oven according to an embodiment of the present invention, and is indicated by reference numeral 10 . The reflow oven 10 has a closed cavity 12, which is composed of a top wall 12a, a bottom wall 12b, a front wall 12c between the top wall and the bottom wall 12a, 12b, and a rear wall between the top wall and the bottom wall 12a, 12b. A wall 12d, and two side walls 12e, 12f connecting all other walls 12a to 12b are formed. The front wall 12c has an inlet 14 and the rear wall 12d has an outlet 16 aligned horizontally with the inlet 14 . The reflow oven 10 includes a number of pairs of upper and lower baffles 18, 20 to form six independent vertical zones, that is, three preheat zones 22, two reflow zones 24 disposed downstream of the preheat zones 22, and A cooling zone 26 downstream of the recirculation zone 24 . Each preheat zone 22 is provided with mutually juxtaposed tip and bottom independent heaters 28,28. A corresponding p...

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PUM

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Abstract

A solder reflow oven is provided to make a bending-preventing mechanism retreat to the lower part of a fixed guide rail to give uniform and sufficient heat to a narrow printed circuit board. A solder reflow oven(10) comprises an enclosed chamber(12) having an inlet(14) and an outlet(16) aligned in a direction parallel to the inlet; a fixed guide rail arranged in the enclosed chamber and extended along the length of the enclosed chamber; a moving guide rail arranged in the enclosed chamber and extended parallel to the fixed guide rail; two conveyor chains each supported on the fixed and moving guide rails; a bending-preventing mechanism slidably arranged between the fixed and moving guide rails; and plural sets of upper and lower heaters(28,34) arranged in the enclosed chamber and each arranged to the upper side of fixed and moving guide rails and to the lower side of slide rails. The moving guide rail is moved toward the fixed guide rail or goes away from the fixed guide rail. The conveyor chains move into the enclosed chamber through the inlet and goes out the enclosed chamber through the outlet. The bending-preventing mechanism includes the slide rails arranged to the lower side of the fixed and moving guide rails; slender-type slidable guides slidably mounted on the slide rails; and support units slidably moving along the slidable guides to support a part of a printed circuit board arranged to the middle between the sides of the printed circuit board. The slide rail has a top surface inclined downward at a position adjacent to the fixed guide rail, to make the slide guide move under the fixed guide rail.

Description

technical field [0001] The present invention generally relates to a reflow oven, and more particularly to an anti-warping mechanism for preventing warpage of a printed circuit board when the side of the printed circuit supported by a conveying device is heated in the reflow oven. Background technique [0002] Reflow soldering is a form of soldering that simultaneously secures many surface mount components to one or both sides of a printed circuit board with minimal thermal stress. In a typical reflow process, solder flux is applied to selected areas of the printed circuit board. Soldering flux, for example, consists of solder particles mixed with fluxes, binders, adhesives, and other components. Surface mount parts such as quad flats and small outline integrated circuits are pressed onto the applied solder flux. The adhesive secures the surface mount component to the printed circuit board. After being so placed, the printed circuit board is transported through a reflow ov...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K31/02B65H23/00H05K3/34
CPCB23K1/0016B23K1/008B23K2101/42H05K3/34
Inventor 横田八治禅三津夫
Owner SENJU METAL IND CO LTD
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