Forecasting method of single crystal internal connecting line-shaped nucleus and growth temp.
A prediction method and growth temperature technology, which can be used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as manpower and material resources.
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Embodiment 1
[0064] Al melt in SiO with a length of 5mm, a width of 400mm, and a depth of 100nm 2 in the base. Al wets SiO 2 The contact angle is 55°, and the data used in the calculation are shown in Table 1.
[0065] Table 1. Values of relevant parameters required to calculate the growth temperature of Al single crystal interconnectors
[0066] h m E(∞) S vir (∞)T m v m K L
[0067] / Jmol -1 / Jmol -1 / Jmol -1 K -1 / K / nm / cm 3 mol -1 / Js -1 k -1 cm -1
[0068] Al 10790 16500 6.15 933 0.286 10 0.94
[0069] R=8.314Jmol -1 K -1 h P =6.6262×10 -34 J·s; k=1.3806×10 -23 J.K. -1
[0070] According to the formula (20), the relationship between the growth length L and the degree of supercooling ΔT is obtained. The specific calculation process is as follows: Let (T m -T) / T m =x, from G(r, T) / r=0 to get the relationship between the critical crystal nucleus size and the degree of supercooling:
[0071] r...
Embodiment 2
[0083] If SiO 2 The dimensions of the substrates are all changed by 10 times, that is, the length is 50mm, the width is 4000mm, and the depth is 1000nm.
[0084] At this point, only the number of Al atoms in a given volume of substrate changes, and the calculation
[0085] n = 50 × 10 6 × 4000 × 1000 ( 4 3 · π · ( h 2 ) 3 ) = 12 × 10 14 ...
Embodiment 3
[0088] Calculate the degree of undercooling required to form a single crystal interconnection when Cu is used as the interconnection material.
[0089] The Cu melt is placed in SiO with a length of 5mm, a width of 400nm and a depth of 100nm 2 Solidification in the substrate forms a Cu single crystal interconnection line. See Table 2 for the data used in the calculation.
[0090] Table 2 Calculation of the relevant parameter values required for the growth temperature of Cu single crystal interconnectors
[0091] h m E(∞) S vir (∞)T m v m K L
[0092] / Jmol -1 / Jmol -1 / Jmol -1 K -1 / K / nm / cm 3 mol -1 / Js -1 k -1 cm -1
[0093] Cu 13050 30500 8.06 1358 0.256 7.1 3.34
[0094] The relationship between the critical crystal nucleus size and the degree of supercooling is:
[0095] r * = [ 4.524 ...
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