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Vapour-deposition source for organic electroluminescent film vapour-deposition

A technology of electroluminescence and organic field, which is applied in the field of evaporation source for organic electroluminescent film evaporation, which can solve the problem that the evaporation material cannot be heated and vaporized, the heat of the side wall 11D cannot be fully transferred, and it is difficult to obtain uniform evaporation Source and other issues

Inactive Publication Date: 2005-11-02
LG DISPLAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, heat is also generated from the side wall 11D corresponding to the portion where the vapor deposition material 20 does not exist, and such heat cannot be directly transferred to the vapor deposition material 20, thereby becoming a factor of wasting energy.
[0021] Another problem that the evaporation source 10 has is that the heat generated by the side wall 11D cannot be sufficiently transferred to the lower part of the evaporation source 10, that is, the evaporation material 20 adjacent to the bottom member 11E.
As a result, all vapor deposition materials 20 cannot be heated and vaporized, especially because of the positional relationship in the vapor deposition source 10, a temperature difference occurs between each vapor deposition material 20 (that is, there is a temperature difference in the vapor deposition source 10). Gradient), so it is difficult to obtain a uniform evaporation source

Method used

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  • Vapour-deposition source for organic electroluminescent film vapour-deposition
  • Vapour-deposition source for organic electroluminescent film vapour-deposition
  • Vapour-deposition source for organic electroluminescent film vapour-deposition

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no. 1 Embodiment

[0048] image 3 a is a cross-sectional view of the vapor deposition source according to the first embodiment of the present invention. The vapor deposition source 100 of this embodiment is a closed container composed of an upper plate 101, a side wall 102, and a bottom member 103, and a vapor deposition material 20 (organic substance) is placed therein. Formed on the upper plate 101 is a vapor release opening 101A (hereinafter referred to as "opening" for simplicity) for releasing the vapor of the vaporized vapor deposition material, and the shielding plate 104 fixed on the bottom surface of the upper plate 101 and the The opening 101A corresponds.

[0049] The upper plate 101 may function as a heating device (heater) for supplying heat to the vapor deposition material 20 , or a separate heating device may be provided on its upper portion (or lower portion). In the following description, a case where the upper plate 101 functions as a heating means (heater) will be described...

no. 2 Embodiment

[0061] Figure 4 It is a cross-sectional view of a vapor deposition source according to a second embodiment of the present invention. The overall structure of the vapor deposition source 200 of this embodiment and image 3 a and image 3 The vapor deposition source 100 shown in c has the same structure. In addition, the upper plate 201 of the vapor deposition source 200 may function as a heating device (heater) for supplying heat to the vapor deposition material 20 , or a separate heating device may be provided on its upper portion (or lower portion). In the following description, a case where the upper plate 201 functions as a heating means (heater) will be described as an example.

[0062] The biggest feature of this embodiment is that its structure can move the bottom member 203 of the evaporation source 200 upward according to the change of the distance between the surface of the evaporation material 20 and the upper plate 201 of the evaporation source 200 .

[0063] A...

no. 3 Embodiment

[0074] Figure 5 It is a cross-sectional view of a vapor deposition source according to a third embodiment of the present invention. The vapor deposition source 300 of this embodiment is also composed of an upper plate 301 functioning as a heating device, a side wall 302 and a bottom member 303 . The structure of the upper plate 301 with the opening 301A and the shielding plate 304 provided is the same as that of the upper plates 101 and 102 of the deposition sources 100 and 200 in the first and second embodiments described above, and therefore its description is omitted.

[0075] Figure 5 The biggest feature of the illustrated evaporation source 300 is that a plurality of coils C1, C2, ..., Cn as heating devices for supplying heat to the evaporation material 20 are wound around the outer peripheral surface of the side wall 302 of the evaporation source 300. , and a cover 350 is provided outside the outer wall 302 .

[0076] A plurality of coils C1, C2, . The lowermost co...

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Abstract

The present invention discloses a deposition source (400, 500 A, 500 B, 500 C, 500 D) installed in a chamber, to form deposition organic electroluminescent layers onto a substrate (12), by applying a vaporized deposition material generated therein to the substrate (12), and by transferring heat to a vapor deposition material (20) received therein, heated by applied electric power, comprising; a top plate (401) on which a vapor efflux aperture (401 A) is formed, a side wall (402) , and a bottom plate (403), said vapor efflux aperture (401 A) having a length (L) which is longer than, or the same as, the width (b) of said substrate (12) to be coated with a deposition organic electroluminescent layers.

Description

[0001] This application is a divisional application of the invention patent application with the filing date of July 18, 2003, the application number of 03178764.9 and the invention title of "Evaporation Source for Evaporation of Organic Electroluminescent Film Evaporation" technical field [0002] The present invention relates to a deposition source for vapor deposition of an organic electroluminescent film. More specifically, it relates to compensating for the increase in the gap between the heating source or the substrate and the vapor deposition material due to the change in the thickness of the vapor deposition material, and to form a uniform luminescent film on the entire surface of the substrate. Evaporation source for electroluminescence film deposition. Background technique [0003] The reduced-pressure vacuum evaporation process (thermophysical vapor deposition process), which is one of the manufacturing processes of low-molecular-weight organic electroluminescent ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/20C23C14/24
CPCC23C14/12C23C14/541H10K71/16
Inventor 金起范金相大韩允洙卓润兴金锡洲
Owner LG DISPLAY CO LTD