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Single-component silver filled conductive glue capable of being stored and transported at normal temperature

A room temperature storage, conductive adhesive technology, used in conductive adhesives, adhesives, epoxy resin adhesives, etc., can solve the problems of conductive adhesive storage and transportation or inconvenient use, and achieve bright appearance, high adhesion, and good electrical conductivity. Effect

Inactive Publication Date: 2007-03-21
贵州振华亚太高新电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a new type of one-component silver-filled conductive adhesive that can be stored and transported at room temperature, so as to overcome the shortcomings of the existing conductive adhesives that are inconvenient to store, transport or use.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] Example 1: Prepare 100 parts of a one-component silver-filled conductive adhesive that can be stored and transported at room temperature, and the quality of each raw material used is:

[0012] Silver powder 74 parts

[0013] E51 epoxy resin 13.5 parts

[0014] 7183 phenolic resin 1.5 parts

[0015] Curing agent dicyandiamide 0.8 parts

[0016] 0.2 parts of 100B curing accelerator

[0017] DBE thinner 10 parts

[0018] After preparing the materials according to the above formula, the epoxy resin and the phenolic resin are heated, dissolved and mixed uniformly, and then the above-mentioned components are rolled and mixed uniformly, and the finished product is obtained after passing the test.

Embodiment 2

[0019] Example 2: Preparation of 100 parts of one-component silver-filled conductive adhesive that can be stored and transported at room temperature, the quality of each raw material used is:

[0020] Silver powder 71 parts

[0021] E51 epoxy resin 13.5 parts

[0022] 7183 phenolic resin 1.5 parts

[0023] Curing agent dicyandiamide 1 part

[0024] 0.2 parts of 100B curing accelerator

[0025] DBE diluent 12.8 parts

[0026] After preparing the materials according to the above formula, the epoxy resin and the phenolic resin are heated, dissolved and mixed uniformly, and then the above-mentioned components are rolled and mixed uniformly, and the finished product is obtained after passing the test.

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PUM

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Abstract

The single-component silver filled conductive glue capable of being stored and transported at normal temperature consists of flaky silver powder as the main component in 70-75 wt%, and supplementary material including organic carrier comprising epoxy resin and phenolic resin 10-15 wt%, curing agent dicyan diamine 0.5-1 wt%, curing promoter carbamide 0.1-0.3 wt%, and diluent mixture of dimethyl adipate, dimethyl glutarate and dimethyl succinate 9-15 wt%. The conductive glue of the present invention is used as the connecting material to replace solder for adhering printed circuit board as well as SMT, quartz resonator, chip, etc. It has excellent conducting performance, high adhesion, easy transportation and storing, and capacity of forming bright and fine cured spot.

Description

technical field [0001] The invention relates to a conductive adhesive, in particular to a microelectronic packaging connection material; in particular, it relates to a one-component silver-filled conductive adhesive that can be stored and transported at room temperature. Background technique [0002] With the development of miniaturization and portability of electronic products, the I / O integration level and line resolution on ICs are constantly improving, especially in order to meet the requirements of environmental protection, conductive adhesive is the best choice to replace solder, and has the advantages of simple coating process , low curing temperature and other characteristics, has been more and more widely used. There are various conductive adhesives on the market. However, most conductive adhesives are required to be stored at -5°C, and dry ice must be used to keep the temperature low during transportation, which is inconvenient for storage...

Claims

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Application Information

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IPC IPC(8): C09J9/02C09J163/00C09J161/06
Inventor 杨荣春吴丹菁张力平
Owner 贵州振华亚太高新电子材料有限公司
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