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Physical value sensor and lead frame for use therein

A technology of physical quantity sensor and lead frame, applied in the field of lead frame

Inactive Publication Date: 2007-06-06
YAMAHA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, in the conventional physical quantity sensor, in order to arrange the physical quantity sensor chip on the inclined installation surface, the package needs to have a sufficient area or height.
Therefore, there is a limit to compactly incorporating it in a small portable terminal device using an existing package.

Method used

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  • Physical value sensor and lead frame for use therein
  • Physical value sensor and lead frame for use therein
  • Physical value sensor and lead frame for use therein

Examples

Experimental program
Comparison scheme
Effect test

no. 2 example

[0139] Next, a second embodiment of the present invention will be described with reference to Figs. 11-13. The lead frame and the magnetic sensor of the second embodiment are different from the first embodiment in the connection of the frame part and the table part. Here, only the connection part of the frame part and the stage part will be described, and the same reference numerals are used for the same parts as the components of the lead frame 1 or the magnetic sensor 30, and the description thereof will be omitted.

[0140] As shown in FIGS. 11 and 12, in the lead frame 2, the base portions 7 and 9 and the rectangular frame portion 13 are connected to each other by connecting wires (connecting portions) 16 protruding from the corners of the rectangular frame portion 13. The connecting wire 16 is formed to protrude a pair from each of the base portions 7 and 9 at a line symmetrical position passing through the central axis L2 of the base portions 7 and 9. Specifically, the one e...

no. 3 example

[0179] Next, the third embodiment of the present invention will be explained.

[0180] As shown in FIGS. 31 and 32, the lead frame 101 has two table portions 107, 109 for arranging magnetic sensor chips (physical quantity sensor chips) 103, 105 formed in a rectangular shape in plan view; frame portions supporting the table portions 107, 109 111; Connecting parts 119, 121 of the table parts 107, 109 and the frame part 111. These table parts 107 and 109, frame part 111, and connection parts 119 and 121 are integrally formed. The frame portion 111 has a rectangular frame portion 113 formed in a rectangular frame shape in plan view, which surrounds the table portions 107 and 109, and a plurality of lead wires 115 and 117 protruding inward from the rectangular frame portion 113. The connecting portions 119 and 121 connect the respective base portions 107 and 109 and the lead wires 117 (three wires each in this embodiment).

[0181] The lead wires 115 and 117 are electrically connected ...

no. 4 example

[0226] Figures 40 to 45 show the fourth embodiment of the present invention. The magnetic sensor (physical quantity sensor) of this embodiment is the same as the above-mentioned embodiment. The direction and magnitude of the external magnetic field are measured by two magnetic sensor chips inclined to each other. It is manufactured by a lead frame formed by press processing or etching processing.

[0227] The lead frame 201, as shown in FIGS. 40 and 41, has two table portions 207, 209 on which magnetic sensor chips (physical quantity sensor chips) 203, 205 formed in a rectangular shape in plan view are mounted; frames supporting the table portions 207, 209部211. These table parts 207 and 209 and the frame part 211 are integrally formed. The frame portion 211 is composed of the following components, surrounds the table portions 207 and 209, and is formed as a rectangular frame portion 213 having a substantially square frame portion in plan view; from each side 213a to 213h of the in...

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PUM

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Abstract

A reed frame made from a thin metallic plate has at least two stage sections on which physical quantity sensor chips are installed and which have smaller area than the installation surfaces of the physical quantity sensor chips, a rectangular frame section surrounding the stage sections, reeds having connection reeds extended from the frame section in the direction of the stage sections, arranged around the stage sections, and connecting the frame section and each of the stage sections, and easily deformable sections formed at the connection reeds and inclining the stage sections by deforming. The physical quantity sensors are arranged with their installation surfaces superposed, in the thickness direction of the frame section, on the stage sections and on portions of the reeds.

Description

Technical field [0001] The invention relates to a physical quantity sensor for measuring the orientation or direction of a physical quantity such as magnetism or gravity, and a lead frame used thereon. [0002] This application is based on Special Application No. 2004-290472 filed on October 1, 2004, Special Application No. 2004-296370 filed on October 8, 2004, and Special Application No. 2005-87621 filed on March 25, 2005. Priority, their content is quoted here. Background technique [0003] In recent years, in portable terminal devices such as mobile phones, devices having a GPS (Global Positioning System) function capable of indicating user location information have appeared. By having the function of accurately detecting the geomagnetism or the function of detecting acceleration in addition to the GPS function, the user can detect the position, direction, or moving direction of the portable terminal device carried in the three-dimensional space. [0004] In order for the port...

Claims

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Application Information

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IPC IPC(8): G01D21/02G01R15/08G01R33/02
CPCH01L2224/32245H01L2224/73265H01L2224/48247H01L2224/48091H01L2924/181
Inventor 白坂健一
Owner YAMAHA CORP
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