Coupled via structure, circuit board having the coupled via structure

Abstract

A coupled via structure includes a plate via penetrating through an board body and having first and second plates spaced apart from each other by a first gap distance, a contact pad connected to the plate via on a surface of the board body and having first and second contacts connected to the first and second plates, respectively, and a connection line connected to the contact pad on the surface of the board body and having first and second lines connected to the first and second contacts, respectively, and spaced apart from the first line by a second gap distance. Accordingly, the deviation of the characteristic impedance is reduced (or, alternatively, minimized) between the coupled via structure and the coupled signal line.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims priority under 35 U.S.C § 119 to Korean Patent Application No. 10-2017-0173158 filed on Dec. 15, 2017 in the Korean Intellectual Property Office, the contents of which are incorporated by reference herein in its entirety.BACKGROUND1. Field[0002]Example embodiments relate to a coupled via structure, circuit board having the coupled via structure and / or a method of manufacturing the circuit board. For example, at least some example embodiments relate to a differential via structure vertically connecting transfer signal lines and complementary signal lines, a circuit board having the differential via structure, and / or a method of manufacturing the circuit board.2. Description of the Related Art[0003]A differential via structure may be used in semiconductor devices for signal integrity to meet the requirements of high integration degree and high operation speed of the recent semiconductor devices as well as excellent p...

AI Technical Summary

Benefits of technology

[0014]According to example embodiments of the present inventive concepts, the characteristic impedance of the coupled via structure may become close to that of the coupled signal line just by changing the shape parameters of the plate via, the contact pad and the connection line. For example, the via width, the height and the first gap distance of the plate via, the length and the second gap distance of the contact pad may be changed to reduce (or, alternatively, minimize) the deviation of the characteristic impedance between the coupled via structure and the coupled signal line. The changes of the shape parameters of the coupled via structure may be automatically repeated until the deviation of the characteristic impedance between the coupled via structure and the coupled signal line may be within an allowable range. Therefore, the signal may be transferred between the upper signal line and the lower signal line via the coupled via structure without significant signal distortions.

[0015]Particularly, the coupled via structure may be configured as flat plate combinations of the plate via, the contact pad and the connection line, thereby facilitating variations of the shapes and the gap distances of coupled via structure. Thus, the parameters of the characteristic impedance of the coupled via structure may be simplified and the variation ranges of the characteristic impedance of the coupled via structure may sufficiently increase in the circuit board. Thus, the coupled via structure for reducing (or, alternatively, minimizing) the deviation of the characteristic impedance with respect to the coupled signal line may be easily formed in the circuit board.

Problems solved by technology

A conventional differential via structure has a complicated shape or configuration and the modification of the shape parameters of the differential via structure usually causes insignificant variations to the characteristic impedance of the differential via structure.

Thus, it may be difficult to adjust the characteristic impedance of the differential via structure to the characteristic impedance of the differential signal line.

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