Polishing pad and polishing apparatus
a technology of polishing apparatus and polishing pad, which is applied in the direction of metal working apparatus, lapping machines, manufacturing tools, etc., can solve the problems of low ability of polishing pads to feed and exhaust abrasive liquid, and the type of polishing pads suffer
Inactive Publication Date: 2007-04-05
KK TOSHIBA
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- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
The present invention provides a polishing pad and a polishing apparatus for polishing a to-be-polished object. The polishing pad has a plate-like pad body with one surface serving as a polishing surface and the other surface serving as a support surface. The pad body has a plurality of hole parts that extend from the polishing surface to the support surface, each hole part containing a plurality of elongated holes that extend in different directions on a plane of the polishing surface. The polishing apparatus includes a holder member for holding the to-be-polished object and a drive mechanism for polishing the object by relatively and frictionally moving the polishing pad and the object. The technical effect of this invention is to provide a polishing pad and apparatus that can polish a to-be-polished object with high efficiency and accuracy.
Problems solved by technology
However, this type of polishing pad suffers from the following problems.
When the foamed urethane is abraded and the polishing grooves wear away, the polishing grooves lose their function of feeding and exhausting the abrasive liquid and of ejecting the polishing waste.
However, this type of polishing pad is low in its ability to feed and exhaust the abrasive liquid.
Further, it is difficult to peel the wafer from the polishing pad since the polishing pad cannot feed air to the central part of the wafer.
Method used
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Embodiment Construction
[0033]FIG. 1 is a side view showing a polishing apparatus 10, which is a first embodiment of the present invention. FIG. 2 is a plan view showing a polishing pad 20 assembled into the polishing apparatus 10.
[0034] The polishing apparatus 10 is comprised of a rotation drive mechanism 11, a surface plate 12 mounted to the rotation drive mechanism 11, a holder mechanism 13 arranged facing the surface plate 12, a moving mechanism 14 for driving the holder mechanism 13 and moving it along the upper surface of the surface plate 12, and a nozzle 15 for feeding an abrasive liquid onto the surface plate 12.
[0035] A polishing pad 20 is detachably attached to the upper surface of the surface plate 12, and a semiconductor wafer W as a to-be-polished object is attached to the holder mechanism 13.
[0036] The polishing pad 20 is provided with a pad body 21 made of resin such as foamed polyurethane or urethane. The pad body 21 is attached to the surface plate 12 in a state that one surface of the...
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Abstract
A polishing pad according to the invention includes a plate-like pad body having one surface serving as a polishing surface and the other surface serving as a support surface, and a plurality of hole parts which extend from the polishing surface to the support surface, the each hole part containing a plurality of elongated holes that extend in different directions on a plane of the polishing surface.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is based upon and claims the benefit of priority from prior Japanese Patent Application No. 2005-290313, field Oct. 3, 2005, the entire contents of which are incorporated herein by reference. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to a polishing pad and a polishing apparatus for polishing a semiconductor wafer, which are used for a chemical and mechanical polishing work in a process of manufacturing semiconductor devices. More particularly, the invention relates to a polishing pad and a polishing apparatus which enable the polishing pad to be elongated and are capable of polishing a semiconductor wafer precisely flat. [0004] 2. Description of the Related Art [0005] In a process of manufacturing semiconductor devices, a chemical and mechanical polishing work is carried out when an insulating film surface of a wafer is flattened. A polishing pad is used for flatte...
Claims
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IPC IPC(8): B24B7/30B24D11/00B24D99/00B24B37/20H01L21/304
CPCB24B37/26B24B37/00B24B37/20H01L21/304
Inventor NAKAHATA, MASAOMI
Owner KK TOSHIBA