Heat sink equipped with a vapor chamber

Abstract

A heat sink equipped with a vapor chamber includes a heat conduction plate and a vapor chamber. The heat conduction plate has one side formed integrally a plurality of radiation fins and another side with two lateral edges formed respectively and integrally a fastening portion. The two fastening portions are interposed by a recess to bond the vapor chamber. Each fastening portion is fastened to a printed circuit board through at least one screw to allow the vapor chamber to contact a heat generation element. The fastening portion is integrally formed at a desired thickness, thus has sufficient strength to withstand the fastening force of the screw to prevent tight sealing between the vapor chamber and heat generation element affected by deformation of the heat conduction plate. Thereby the vapor chamber can smoothly contact the heat generation element to rapidly transfer heat outside.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a heat sink and particularly to a heat sink equipped with a vapor chamber.BACKGROUND OF THE INVENTION[0002]Please refer to FIG. 1, a conventional heat sink includes a heat conduction plate 1 and a vapor chamber 2. The heat conduction plate 1 has one side formed a plurality of radiation fins 3 and another side bonded to the vapor chamber 2, and two lateral sides fastened to a printed circuit board (PCB in short, not shown in the drawing) through at least one screw 4. The vapor chamber 2 is in contact with a heat generation element (not shown in the drawing) of the PCB, and is hollow and vacuumed to seal heat transfer fluid 5 (pure water) inside which can rapidly transfer heat through phase transition between liquid and gas states. Hence the heat generated by the heat generation element can be quickly spread by the vapor chamber 2 to the radiation fins 3 to dissipate the heat to lower the temperature.[0003]To save material, ...

AI Technical Summary

Benefits of technology

[0005]Therefore, the primary object of the present invention is to provide a heat sink that can quickly and effectively transfer heat outside to achieve desired cooling effect.

[0007]The fastening portion is fastened to a PCB through at least one screw to make the vapor chamber in contact with a heat generation element. As the fastening portion is formed integrally at a desired thickness, it has a sufficient strength to withstand the fastening force of the screw, thus tight sealing between the vapor chamber and heat generation element affected by deformation of the heat conduction plate can be prevented, and the vapor chamber can smoothly contact the heat generation element to quickly and effectively transfer heat outside.

Problems solved by technology

As a result, heat transfer effect suffers.

All these hamper heat dissipation effect of the heat sink.

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