Integrated circuit packaging system with support structure and method of manufacture thereof

Inactive Publication Date: 2013-09-26
STATS CHIPPAC LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a method and system for packaging integrated circuits. The system includes a support structure with a non-horizontal surface, a contact coplanar with the support structure, an insulation layer between the support structure and the contact, and an upper support pad on top of the insulation layer. The integrated circuit is then mounted on top of the upper support pad. This system allows for improved performance and reliability of the integrated circuit.

Problems solved by technology

While these approaches provide more functions within an integrated circuit, they do not fully address the requirements for integration and cost reduction.
Solutions to these problems have been long sought but prior developments have not taught or suggested any solutions and, thus, solutions to these problems have long eluded those skilled in the art.

Method used

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  • Integrated circuit packaging system with support structure and method of manufacture thereof
  • Integrated circuit packaging system with support structure and method of manufacture thereof
  • Integrated circuit packaging system with support structure and method of manufacture thereof

Examples

Experimental program
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Effect test

first embodiment

[0034]Referring now to FIG. 1, therein is shown a cross-sectional view of an integrated circuit packaging system 100 taken along line 1-1 of FIG. 2 in the present invention. The integrated circuit packaging system 100 can include electronic semiconductor packages.

[0035]The integrated circuit packaging system 100 can include a single-layer substrate 102, which is defined as a support structure having a single core metal layer for mounting and connecting a semiconductor device thereto including providing electrical connections through the support structure. The single-layer substrate 102 can represent a single metal layer substrate.

[0036]The single-layer substrate 102 can include a single-layer support structure 104 having a structure lower surface 106, a structure upper surface 108, and a structure non-horizontal surface 110. The single-layer substrate 102 can include single-layer contacts 112, each of which having a contact lower surface 114, a contact upper surface 116, and a conta...

second embodiment

[0078]Referring now to FIG. 13, therein is shown a cross-sectional view of an integrated circuit packaging system 1300 in the present invention. In a manner similar to the integrated circuit packaging system 100 of FIG. 1, the integrated circuit packaging system 1300 includes a single-layer substrate 1302.

[0079]In a manner similar to the integrated circuit packaging system 100, the single-layer substrate 1302 includes a single-layer support structure 1304 having a structure lower surface 1306, a structure upper surface 1308, and a structure non-horizontal surface 1310. In a manner similar to the integrated circuit packaging system 100, the single-layer substrate 1302 includes single-layer contacts 1312, each of which having a contact lower surface 1314, a contact upper surface 1316, and a contact non-horizontal surface 1318.

[0080]In a manner similar to the integrated circuit packaging system 100, the single-layer substrate 1302 includes a single-layer insulation 1320 having an insul...

third embodiment

[0090]Referring now to FIG. 14, therein is shown a cross-sectional view of an integrated circuit packaging system 1400 in the present invention. In a manner similar to the integrated circuit packaging system 100 of FIG. 1, the integrated circuit packaging system 1400 includes a single-layer substrate 1402.

[0091]The single-layer substrate 1402 includes a single-layer support structure 1404 having a structure lower surface 1406, a structure upper surface 1408, and a structure non-horizontal surface 1410. In a manner similar to the integrated circuit packaging system 100, the single-layer substrate 1402 includes single-layer contacts 1412, each of which having a contact lower surface 1414, a contact upper surface 1416, and a contact non-horizontal surface 1418.

[0092]In a manner similar to the integrated circuit packaging system 100, the single-layer substrate 1402 includes a single-layer insulation 1420 having an insulation lower surface 1422 and an insulation upper surface 1424. The s...

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Abstract

A method of manufacture of an integrated circuit packaging system includes: providing a single-layer support structure having a structure non-horizontal surface; forming a single-layer contact coplanar with the single-layer support structure, the single-layer contact having a contact non-horizontal surface; forming a single-layer insulation coplanar with the single-layer contact and horizontally between the structure non-horizontal surface and the contact non-horizontal surface; forming an upper support pad over the single-layer insulation and directly on the single-layer support structure; and mounting an integrated circuit over the upper support pad.

Description

TECHNICAL FIELD[0001]The present invention relates generally to an integrated circuit packaging system, and more particularly to a system for an integrated circuit packaging system with support structure.BACKGROUND ART[0002]Increased miniaturization of components, greater packaging density of integrated circuits (“ICs”), higher performance, and lower cost are ongoing goals of the computer industry. Semiconductor package structures continue to advance toward miniaturization, to increase the density of the components that are packaged therein while decreasing the sizes of the products that are made therefrom. This is in response to continually increasing demands on information and communication products for ever-reduced sizes, thicknesses, and costs, along with ever-increasing performance.[0003]These increasing requirements for miniaturization are particularly noteworthy, for example, in portable information and communication devices such as cellular phones, hands-free cellular phone ...

Claims

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Application Information

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IPC IPC(8): H01L23/34H01L21/56H01L21/50
CPCH01L23/3128H01L2221/68345H01L2224/48091H01L2224/48227H01L2224/32225H01L2224/32106H01L23/3677H01L23/49816H01L23/49827H01L23/49861H01L21/486H01L24/32H01L21/6835H01L24/48H01L24/83H01L2224/73265H01L2924/00014H01L2924/00H01L2924/12042H01L2924/181H01L2924/00012H01L2224/45099H01L2224/45015H01L2924/207
InventorCHEN, HSIN HUNGLEE, CHIEN CHEN
OwnerSTATS CHIPPAC LTD