Unlock instant, AI-driven research and patent intelligence for your innovation.

Package structure

a packaging and structure technology, applied in the field of packaging structure, can solve the problems of unsatisfactory prior art package structure b>10/b>, adversely affect the appearance of the package structure,

Active Publication Date: 2017-05-11
PIXART IMAGING INC
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art package structure 10, the housing 13 which encompasses the chip module 12 is bonded onto the substrate 11 by the adhesive 14; however, if the adhesive 14 is applied too much, it may adversely affect the appearance of the package structure 10, and if the adhesive 14 is applied too little, the housing 13 may be detached from the substrate (peeling).
Thus, the prior art package structure 10 is unsatisfactory.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Package structure
  • Package structure
  • Package structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023]The drawings as referred to throughout the description of the present invention are for illustrative purpose only, to show the interrelations between the components, but not drawn according to actual scale. The shape, thickness and width of a component can be modified during implementation.

[0024]FIGS. 2, 3A-3D, 4, and 5A-5C show a package structure 20 according to one embodiment of the present invention. FIG. 2 shows a top view of the housing 23 and the substrate 21, before the housing 23 and the substrate 21 are bonded together. FIG. 4 shows a top view of the package structure 20, after the housing 23 and the substrate 21 are bonded together to form the package structure 20. FIGS. 3A-3C show cross-section views respectively according to the cross-section lines AA, BB, and CC shown in FIG. 2. FIG. 3D is a partial enlarged view according to FIG. 3C. FIGS. 5A-5C show cross-section views respectively according to the cross-section lines AA, BB, and CC shown in FIG. 4.

[0025]As sho...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
adhesionaaaaaaaaaa
inner radiusaaaaaaaaaa
areaaaaaaaaaaa
Login to View More

Abstract

The invention provides a package structure which includes a substrate, at least one chip module, and a housing. The at least one chip module is located on the substrate. The housing includes an upper cover, a surrounding wall, and at least one adhesion enhancement structure. The surrounding wall is connected to the upper cover and encompasses the at least one chip module. The surrounding wall and the adhesion enhancement structure are bonded to the substrate by an adhesive. The adhesion enhancement structure includes an encircled hole or a semi-encircled hole.

Description

CROSS REFERENCE[0001]The present invention claims priority to TW 104136576, filed on Nov. 6, 2015.BACKGROUND OF THE INVENTION[0002]Field of Invention[0003]The present invention relates to a package structure, in particular a package structure including at least one adhesion enhancement structure for increasing a bonding effect between a housing and a substrate of the package structure.[0004]Description of Related Art[0005]FIG. 1 shows a prior art package structure 10, which includes a substrate 11, at least one chip module 12, a housing 13, and an adhesive 14. The chip module 12 is located on the substrate 11, and the adhesive 14 bonds the housing 13 and the substrate 11 together.[0006]In the prior art package structure 10, the housing 13 which encompasses the chip module 12 is bonded onto the substrate 11 by the adhesive 14; however, if the adhesive 14 is applied too much, it may adversely affect the appearance of the package structure 10, and if the adhesive 14 is applied too litt...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): H01L23/16H01L23/055
CPCH01L23/055H01L23/16H01L23/04H01L23/10
Inventor LI, KUO-HSIUNGSHEN, CHI-CHIHCHUANG, JUI-CHENGCHEN, JEN-YU
Owner PIXART IMAGING INC