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Components placing apparatus

a technology of electronic components and placing apparatuses, which is applied in the direction of manufacturing tools, transportation and packaging, other manufacturing equipment/tools, etc., can solve the problem of becoming unsuitable for placing electronic components on the board

Inactive Publication Date: 2005-12-20
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

"The present invention provides an electronic component placing apparatus for placing electronic components on a board. The apparatus includes an electronic component feeding unit, a carrying unit, a plurality of head units, and a drive unit. The apparatus has a substantial width along the carrying direction of the board carrying unit, which is determined by the length of the board carrying position and the space needed for the board stop mechanism. The apparatus can be mounted on a board producing apparatus for producing mounted boards. The apparatus has a compact design and can be easily moved and positioned. The technical effects of the invention include improved efficiency in electronic component placement, reduced apparatus width, and improved protection of components during placement and reflow work."

Problems solved by technology

However, with diversification of portable terminals, production (mounting) of many types of boards in a small number is more strongly required, and hence the configuration of the electronic component placing system 9 shown in FIG. 12 is becoming unsuitable to placement of electronic components on a board for a portable terminal.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

first embodiment

(First Embodiment)

[0101]FIG. 1A is a perspective view showing an external appearance of an electronic component placing system 2 constituted by a plurality of electronic component placing apparatuses in a mounted-board producing apparatus 1 according to a first embodiment of the present invention. FIG. 1B is a perspective view showing a board 8 on which electronic components 99 are mounted by the plurality of electronic component placing apparatuses in the electronic component placing system 2. The electronic component placing system 2 is disposed between a printer 11 and reflow apparatus 12 of solder pastes in the mounted-board producing apparatus 1 for mounting electronic components 99 on the board 8.

[0102]The electronic component placing system 2 has five high-speed placing apparatuses 21 (as one example of the electronic component placing apparatus) and three multifunctional placing apparatuses 22 (as another example of the electronic component placing apparatus), and an inspect...

second and third embodiments

(Second and Third Embodiments)

[0167]Second and third embodiments of the present invention relate to a mounted-board producing apparatus including a placement work unit for placing a plurality of electronic components on a board with solder therebetween, and a reflow work unit for allowing the solder to reflow to fix the electronic components on the board, wherein, while a plurality of the boards are carried into the placement work unit and the reflow work unit, a plurality of mounted boards are produced from the plurality of boards.

[0168]Conventionally, various structures of this type of mounted-board producing apparatus are known. For example, a conventional mounted-board producing apparatus 1201, as shown in FIG. 18, is disposed on a carrier line and, by a plurality of types of work apparatuses performing predetermined tasks for boards, electronic components are mounted on a plurality of boards successively carried in these work apparatuses to produce mounted boards.

[0169]In FIG. ...

sixth embodiments

(Fourth to Sixth Embodiments)

[0229]The fourth to sixth embodiments of the present invention relate to the structures of the electronic component placing apparatuses according to the first to third embodiments, which places electronic components 99 on a circuit board 8.

[0230]In recent years, high-speed and precise mounting of electronic components has been required in electronic component mounting.

[0231]A conventional electronic component placing apparatus is explained below with reference to FIG. 19. FIG. 19 is a general schematic view showing an electronic component placing apparatus. In FIG. 19, reference numeral 801 denotes a carrying unit for carrying in and out an electronic circuit board 8. Reference numeral 803 denotes an X-axis ball screw shaft. Reference numeral 804 denotes a Y-axis ball screw shaft. This apparatus is constituted such that nozzles 807 for sucking and placing electronic components 99 from a component feeding unit 805 and a board recognition camera 810 for me...

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Abstract

A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL. Specifically, 4L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.

Description

BACKGROUND OF THE INVENTION[0001]The present invention relates to an electronic component placing apparatus for placing electronic components on a board and a mounted-board producing apparatus.[0002]Conventionally, when electronic components are mounted on a board such as a printed board, processes of printing a cream-like solder paste on the board, placing the electronic components on the printed solder paste, and heating and cooling the board on which the electronic components are placed to solidify the solder so that the electronic components are fixed on the board are performed.[0003]FIG. 12 is a perspective view showing a configuration of an electronic component placing system 9 for placing electronic components on a board in a conventional mounting system for mounting electronic components on a board. In the electronic component placing system 9, a board on which solder pastes are printed is carried in from a printer from a direction shown with an arrow 901, and the board is c...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H05K13/02
CPCH05K13/02Y10S29/044Y10T29/53174Y10T29/4913Y10T29/53196Y10T29/53261Y10T29/49133Y10T29/49144Y10T29/53178Y10T29/53087Y10T29/53083Y10T29/5136Y10T29/53187Y10T29/53183
Inventor NAKAMURA, YOUICHISAKURAI, KUNIOOKUMURA, KAZUMASATAKANO, KENYAMAMOTO, MINORUHONKAWA, HIROKAZUNISHIWAKI, KENTAROMISAWA, YOSHIHIKO
Owner PANASONIC CORP