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Semiconductor device

a technology of semiconductors and devices, applied in the direction of semiconductor lasers, lasers, semiconductor laser structural details, etc., can solve the problems of induced problems, difficult parts sharing,

Inactive Publication Date: 2007-02-20
SONY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This configuration allows for reliable wire bonding from either surface, enabling the use of common parts across different electric circuits without increasing the apparatus size, enhancing the flexibility and reliability of the semiconductor laser apparatus.

Problems solved by technology

Thus, in the conventional semiconductor laser apparatus, in coping with the various electric circuits, it was difficult to perform sharing of parts.
Thus, another problem is induced.

Method used

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  • Semiconductor device
  • Semiconductor device
  • Semiconductor device

Examples

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Embodiment Construction

[0020]An embodiment of the present invention in a case of an application to a semiconductor laser apparatus, for example, for a bar code reader will be described below in detail with reference to the drawings.

[0021]FIG. 1A to FIG. 1C are views showing the configuration of the semiconductor laser apparatus according to the embodiment of the present invention. FIG. 1A is a view when the semiconductor laser apparatus is viewed from one direction, FIG. 1B is a side view including a partially ruptured surface of the semiconductor laser apparatus, and FIG. 1C is a view when the semiconductor laser apparatus is viewed from the other direction. The shown semiconductor laser apparatus is constituted such that a housing 1, which is made of insulating material, for example, such as resin and the like, and approximately rectangular when it is viewed from a flat surface, is used as a base member. A plurality of (five in the shown example) leads 2, 3, 4, 5 and 6 are adhered to the housing 1 servi...

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PUM

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Abstract

This is a semiconductor apparatus capable of realizing a sharing of parts without introducing enlargement of the apparatus and deterioration in reliability of the wire bonding in case of responding to various electronic circuits. It is a semiconductor laser apparatus configured to include a housing (1) in which device mounting portions (1A), (1B) are respectively formed on both one surface side and the other surface side thereof; a semiconductor laser device (1) mounted in the device mounting portion (1A) on one surface side of this housing; a photo-diode (11) mounted in the device mounting portion (1B) on the other surface side of the housing; and a plurality of leads (3), (4), (5), and (6) connected through wires (8) to either the semiconductor laser device (7) or the photo-diode (11), wherein the pad portions (5B) of the leads (5) are exposed to the device mounting portions (1A), (1B) in the position relation alternate with each other on the one surface side and the other surface side of the housing (1), so that the wire bonding to the pads (5B) of the leads (5) is properly performed from either one surface side or the other surface side of the housing (1) by setting this exposed portion as the connection portion of the wire bonding.

Description

[0001]The present invention relates to a semiconductor apparatus that uses a housing that is able to mount devices on one surface side and the other surface side.[0002]FIG. 5A to FIG. 5C show configurations of a conventional semiconductor laser apparatus, wherein FIG. 5A is a chart when the semiconductor laser apparatus is viewed from one direction, FIG. 5B is a side view including a partial fracture surface of the semiconductor laser apparatus, and FIG. 5C is a chart when the semiconductor laser apparatus is viewed from the other direction. The semiconductor laser apparatus in these figures is configured such that an insulating housing 51 is used as a base member. A plurality of (5 in the shown example) leads 52, 53, 54, 55 and 56 are fixed by adhesion to the housing 51, for example, by an insert molding. The respective leads 52 to 56 are electrically insulated from each other by the housing 51. Also, one end sides of the respective leads 52 to 56 are exposed to outside in the situ...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H01L23/02H01L21/60H01S5/02H01S5/0232
CPCH01S5/02288H01S5/02244H01L24/85H01L2224/48247H01L2224/45144H01L2224/85H01S5/0683H01S5/02276H01S5/02216H01L2224/49171H01L2224/49175H01L2924/01046H01L2924/01079H01L2924/00H01L2924/00014H01L2924/12043H01L2224/0603H01L2224/05552H01L24/48H01L2224/05553H01L24/49H01S5/02253H01S5/02345H01S5/0232
Inventor AIZAWA, HIDEKUNIIZAWA, HISATAKAMATSUDA, TAKEHIKO
Owner SONY CORP