6results about How to "Keep the thickness" patented technology

The utility model belongs to the technical field of blankets, and particularly relates to a wear-resistant blanket. Comprising a blanket body, the blanket body comprises a surface layer and an inner layer, the edges of the surface layer and the inner layer are connected through side strips, and the two ends of each side strip are sewn to the edges of the surface layer and the inner layer; the zipper is arranged on the right side of the side strip; the fluff layers are arranged on the upper side and the lower side of the blanket body, and the fluff layers are evenly distributed at equal intervals; the wear-resistant layers are arranged on the upper side and the lower side of the blanket body and used for improving the wear resistance of the blanket; the wear-resisting layer comprises a plurality of protruding points which are evenly distributed in the length direction of the blanket body at intervals, and the protruding points and the fluff layer are distributed on the surface of the blanket body at intervals. The utility model provides the wear-resistant blanket which is wear-resistant and can reduce the surface wear of the blanket.

A foam body is integrally formed by upper foam and lower foam in a hot pressing mode, the outer wall of the left side of the lower foam horizontally extends outwards to form a first protruding part, and the outer wall of the right side of the lower foam horizontally extends outwards to form a second protruding part. A left side upper connecting strip and a left side lower connecting strip are bonded to the top face and the bottom face of the first protruding part correspondingly, a right side upper connecting strip and a right side lower connecting strip are bonded to the top face and the bottom face of the second protruding part correspondingly, and a first sliding groove is formed in the left side upper connecting strip. A first sliding block matched with the first sliding groove is formed on the surface of the upper connecting strip on the right side in a protruding mode. The left side upper connecting strip, the left side lower connecting strip, the right side upper connecting strip, the right side lower connecting strip and other parts are all located outside the conductive foam, so that normal compression deformation of the conductive foam cannot be affected, the use scene of the conductive foam cannot be limited, and the use effect is good.

This invention discloses a method for preparing van der Waals metal thin films. The method includes the following steps: S1, coating a polyvinyl alcohol (PVA) film onto the surface of a supporting substrate; S2, depositing a metal film on the surface of the PVA film to obtain an intermediate; S3, placing the intermediate in water at 60-80°C to remove the PVA film, obtaining a floating metal film; transferring the metal film to the surface of a target substrate, and bonding the two together using van der Waals forces to obtain the final product. This invention utilizes the controllable dissolution properties of PVA, achieving the separation and transfer of the metal film from the supporting substrate using deionized water, avoiding the use of toxic chemical solvents and interface damage caused by high-energy bombardment. The method is simple, environmentally friendly, and can be widely applied to the preparation of van der Waals heterostructures such as metal-semiconductor and metal-insulator structures.

This utility model discloses a sponge with good resilience, comprising a sponge base layer, a rebound material layer, a sponge interlayer, a mesh layer, a sponge surface layer, and a protective layer. The sponge base layer, rebound material layer, sponge interlayer, sponge surface layer, and protective layer are bonded together in sequence from bottom to top, and a mesh layer is provided between the sponge interlayer and the sponge surface layer. The rebound material layer has a wavy structure, and the upper surface of the rebound material layer is adapted to the lower surface of the sponge interlayer. The wavy structure increases the contact area between the rebound material layer and adjacent sponge layers, which can better disperse and absorb external forces. The combination of crests and troughs allows the rebound material layer to better disperse and absorb pressure when subjected to external forces, avoiding excessive compression of the sponge, reducing sponge deformation and collapse, and ensuring its performance stability. When the external force acting on the sponge is removed, the sponge can quickly return to its original shape, significantly improving the sponge's resilience.

The present invention relates to a back-drilled composite cover plate and a processing method for controlling the drilling depth of a circuit board. With the promotion of 4G, 5G and future 6G communications, the back-drilling process will become an indispensable manufacturing process in the production process of circuit boards for communications, wherein the back-drilled composite cover plate comprises a processing surface insulating layer, a conductive layer carrier and a conductive layer; the conductive layer carrier and the conductive layer are combined by electroplating, vacuum evaporation deposition or coating; the processing surface insulating layer and the conductive layer carrier are combined by bonding, laminating or pressing; due to the use of a composite structure, the present invention can make the selection range of the processing surface insulating layer material wider under the premise of ensuring the drilling accuracy. For example, the use of insulating and environmentally friendly materials that are both high-temperature resistant and not prone to drill wire can not only improve the high-temperature resistance of the back-drilled composite cover plate, but also avoid the back-drilled composite cover plate from generating drill wire during the drilling process, which is adhered to the drill bit and blocks the chip groove of the drill bit, and is suitable for the rapid drilling process.

The present invention discloses a prepreg containing wide melting limit polyamide particles and a high-toughness and high-shear strength composite material, belonging to the technical field of composite materials. The prepreg comprises reinforcing fibers and an uncured resin matrix; the uncured resin matrix comprises a resin component, a curing agent, a soluble thermoplastic toughening agent and thermoplastic toughening particles, wherein the resin component comprises at least one epoxy resin, and the thermoplastic toughening particles comprise wide melting limit polyamide particles. The wide melting limit polyamide particles have crystalline regions and non-crystalline regions, which can maintain the thickness and regularity of the toughening layer and form an interpenetrating network with the matrix resin, so that the post-impact compression strength and interlaminar shear strength of the composite material can be significantly improved, meeting the requirements of the aerospace field for high impact toughness of carbon fiber composite materials.