Substrate, method of manufacturing multi-layer substrate, and satellite broadcasting reception apparatus
A multi-layer substrate, substrate technology, applied in the direction of satellite broadcast reception, multi-layer circuit manufacturing, broadcast receiving circuit, etc., can solve the problem of not revealing the stability of the position, and achieve the effect of high reliability
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Embodiment 1
[0048] figure 2 In the substrate 1 according to embodiment 1 (see figure 1 ) An enlarged detailed view of the area surrounding part A.
[0049] The substrate 1 according to the present embodiment includes a main substrate 2 having a pattern 6 as a first pattern layer on a main surface; a sub-substrate 3 having a dummy pattern 5 as a second pattern layer on a main surface; a bridge portion 4 (connecting part), which connects the main substrate 2 and the sub-substrate 3; and the thin part 10A, which is provided on the bridge part 4 between the patterns 5, 6, as figure 2 shown.
[0050] Here, the patterns 5, 6 are formed in regions surrounded by the pattern outlines 5A, 6A, respectively. Thin portion 10A is a portion located between portions where patterns 5 , 6 are formed (thick portion) and exposes main substrate 2 , and its thickness is relatively small compared to the thick portion.
[0051] The substrate 2 is not reinforced by the patterns 5 , 6 in the thin portion 10...
Embodiment 2
[0060] image 3 is part A of the substrate 1 according to embodiment 2 (see figure 1 ) is a zoomed-in detailed view of the area surrounding .
[0061] In the substrate 1 according to this embodiment, the through hole 7 is provided in the vicinity of the bridge portion 4 (connection portion) on the main substrate 2, as image 3 shown.
[0062] Accordingly, the via region 7B is formed on the main substrate 2 in the vicinity of the separation line 10 between the main substrate 2 and the sub-substrate 3 . Since the pattern 6 is not formed in the area 7B, the recess 8 is formed in the pattern outline 6A. As a result, the pattern 6 near the separation line 10 will not come off during the process of separating the main substrate 2 from the sub-substrate 3 .
[0063] It should be noted that detailed descriptions of those components in this embodiment that are similar to those in Embodiment 1 will not be repeated.
Embodiment 3
[0065] Figure 4 is part A of the substrate 1 according to embodiment 3 (see figure 1 ) is a zoomed-in detailed view of the area surrounding .
[0066] In the substrate 1 according to the present embodiment, the through hole 7 is provided along the pattern outline 6A so that the pattern outline 6A is away from the bridge portion 4 (connection portion) and near the connection portion, as Figure 4 shown.
[0067] Thus, the through-hole region 7B and the patternless region 8A are formed in the vicinity of the separation line 10 between the main substrate 2 and the sub-substrate 3 in the main substrate 2 . Since the pattern 6 is not formed in the regions 7B, 8A, a larger recess 8 than in Embodiment 2 is formed in the pattern outline 6A. As a result, in the process of separating the main substrate 2 and the sub-substrate 3 , the effect of preventing the detachment of the pattern 6 near the separation line 10 is enhanced.
[0068] It should be noted that detailed descriptions ...
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Abstract
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